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Silicon Germanium

Chemical Formula: 
SiGe
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Equipment name & NEMO ID Training Required & Charges Cleanliness Locationsort descending Notes
Oven BlueM 200°C to 430°C
bluem
Blue M Oven Training Flexible SNF Cleanroom Paul G Allen L107

Convection in N2. Cure. Programmable.

Flexus 2320 Stress Tester
stresstest
Stress Tester Flexus 2320 Training All SNF Cleanroom Paul G Allen L107
Tystar Bank 2 Tube 6
B2T6 Clean Oxide
Tystar Atmospheric Tube Training Clean SNF Cleanroom Paul G Allen L107
Woollam
woollam
Woollam Training All SNF Cleanroom Paul G Allen L107
Wet Bench Clean_res-piranha
wbclean_res-piranha
Wet Bench Clean Piranha/HF/Phosphoric Training Clean SNF Cleanroom Paul G Allen L107

Resist will be removed

Oven 110°C post-bake
oven110
Resist Postbake Oven 110°C Training All SNF Cleanroom Paul G Allen L107

Bakes wafers with resist after the development, called post-bake.

Tystar Bank 3 Tube 9
B3T9 Clean Oxide
Tystar Atmospheric Tube Training Clean SNF Cleanroom Paul G Allen L107
LEI1500 Contactless Sheet Resistance Mapping
eddycurrent
LEI1500 Contactless Sheet Resistance Mapping Training All SNF Exfab Paul G Allen 151 Ocean
Lakeshore Hall Measurement System
LakeshoreHall
Lakeshore Hall Measurement System training All SNF Exfab Paul G Allen 151 Ocean
micromanipulator6000 IV-CV probe station
micromanipulator6000
micromanipulator6000 IV-CV probe station Training All SNF Exfab Paul G Allen 151 Ocean
AJA Evaporator
aja-evap
Evaporator AJA training Flexible SNF Exfab Paul G Allen 155A Venice

For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance

Lesker Sputter
lesker-sputter
Sputter Lesker 1&2 Training Flexible SNF Exfab Paul G Allen 155A Venice

reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter

PDS 2010 LABCOTER™ 2 Parylene Deposition System
parcoater
Parylene Coater Training Flexible SNF Exfab Paul G Allen 155 Mavericks

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Equipment name & NEMO ID Technique Cleanliness Primary Materials Etched Other Materials Etched Developer Process Temperature Range Chemicals Gases Substrate Size Substrate Type Maximum Load
Wet Bench CMOS Metal
wbclean3
Semiclean
,
,
25 wafers
Wet Bench Decontamination
wbdecon
Clean
,
,
Wet Bench Flexcorr 1
wbflexcorr-1
Flexible ,
,
,
,
,
,
,
,
,
,
Wet Bench Flexcorr 2
wbflexcorr-2
Flexible ,
,
,
,
,
,
,
,
,
,
Wet Bench Flexcorr 3
wbflexcorr-3
Flexible ,
,
,
,
,
,
,
,
,
Wet Bench Flexible Solvents
wbflexsolv
Flexible ,
,
,
,
,
,
,
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,
,
Wet Bench Flexible Solvents 1
wbflexsolv-1
Flexible ,
,
,
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,
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,
,
,
Wet Bench Flexible Solvents 2
wbflexsolv-2
Flexible ,
,
,
,
,
,
,
,
,
,
Wet Bench Miscellaneous
wbmiscres
Flexible ,
,
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Wet Bench Resist Strip
wbresstrip-1
Clean (Ge), Semiclean, Flexible
20 °C - 60 °C
,
,
,
,
,
,
25 4 inch wafers
Wet Bench Solvent Lithography
lithosolv
Flexible ,
,
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Woollam
woollam
All ,
,
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1
Xactix Xenon Difluoride Etcher
xactix
All ,
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,
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,
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1

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