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Silicon Carbide

Chemical Formula: 
SiC
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Equipment name & NEMO ID Training Required & Charges Cleanliness Locationsort ascending Notes
Lesker2 Sputter
lesker2-sputter
Sputter Lesker 1&2 Training Semiclean SNF Cleanroom Paul G Allen L107

reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter

Wet Bench Resist Strip
wbresstrip-1
Wet Bench Resist Strip Clean (Ge), Semiclean, Flexible SNF Cleanroom Paul G Allen L107

Wet Resist Removal: SRS-100 or PRS1000

Wet Bench Flexible Solvents 1
wbflexsolv-1
Wet Bench Flexible Solvents 1 and 2 Training Flexible SNF Cleanroom Paul G Allen L107

Manual solvent cleaning, two ultrasonic baths.

Wet Bench Flexible Solvents 2
wbflexsolv-2
Wet Bench Flexible Solvents 1 and 2 Training Flexible SNF Cleanroom Paul G Allen L107

Manual solvent cleaning, hot plate

Wet Bench Flexcorr 3
wbflexcorr-3
Wet Bench Flexcorr 1and2 and 3and4 Training Flexible SNF Cleanroom Paul G Allen L107

Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed.

Wet Bench Flexible Solvents
wbflexsolv
Wet Bench Flexible Solvents 1 and 2 Training Flexible SNF Cleanroom Paul G Allen L107

Manual solvent cleaning of substrates or resist removal.

Critical Point Dryer Tousimis Automegasamdri-915B
cpd
Critical Point Dryer Training Flexible SNF Cleanroom Paul G Allen L107

CO2 drying after release of micromachined devices

Xactix Xenon Difluoride Etcher
xactix
Xactix Xenon Difluoride Etcher Training All SNF Cleanroom Paul G Allen L107

Isotropic Si etching; can be used for backside Si removal on small pieces

SEM -Zeiss Merlin
sem-merlin
SEM-Merlin Training All SNF Exfab Paul G Allen 104 Stinson
Profilometer AlphaStep D-300
alphastep2
AlphaStep2 Training Flexible SNF Exfab Paul G Allen 104 Stinson
Heidelberg MLA 150
heidelberg
Heidelberg Training All SNF Exfab Paul G Allen 104 Stinson

Direct Write

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Equipment name & NEMO ID Technique Cleanliness Primary Materials Etched Other Materials Etched Material Thickness Range Process Temperature Range Chemicals Gases Sample Size Limits Substrate Size Substrate Type Maximum Load
SEM -Zeiss Merlin
sem-merlin
All
0.00 mm - 35.00 mm
6 in wafer ,
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SPTS uetch vapor etch
uetch
All ,
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1
Wet Bench Flexcorr 1
wbflexcorr-1
Flexible ,
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Wet Bench Flexcorr 2
wbflexcorr-2
Flexible ,
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Wet Bench Flexcorr 3
wbflexcorr-3
Flexible ,
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Wet Bench Flexible Solvents
wbflexsolv
Flexible ,
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Wet Bench Flexible Solvents 1
wbflexsolv-1
Flexible ,
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Wet Bench Flexible Solvents 2
wbflexsolv-2
Flexible ,
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Wet Bench Resist Strip
wbresstrip-1
Clean (Ge), Semiclean, Flexible
20 °C - 60 °C
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25 4 inch wafers
Woollam
woollam
All ,
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1
Xactix Xenon Difluoride Etcher
xactix
All ,
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1

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