Equipment name & NEMO ID | Technique | Cleanliness | Material Thickness Range | Materials Lab Supplied | Minimum Resolution | Exposure Wavelength | Resist | Process Temperature Range | Chemicals | Gases | Sample Size Limits | Resolution Notes | Substrate Size | Substrate Type | Maximum Load |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
LEI1500 Contactless Sheet Resistance Mapping eddycurrent |
All | 8 in wafer |
Sensor Transducer Size is 14 mm diameter |
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1 wafer(2" to 8") | ||||||||||
Lakeshore Hall Measurement System LakeshoreHall |
All |
100.00 μm -
1000.00 μm
|
-258 °C - 1000 °C
|
8 in wafer |
Sensor Transducer Size is 14 mm diameter |
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1 piece | ||||||||
Heidelberg MLA 150 - 2 heidelberg2 |
All |
|
375 nm |
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1 | ||||||||||
Heidelberg MLA 150 heidelberg |
All |
|
405 nm |
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1 | ||||||||||
Headway Manual Resist Spinner headway2 |
All |
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one piece or wafer | ||||||||||||
Fiji 2 ALD fiji2 |
Flexible |
1.00 Å -
50.00 nm
|
24 °C - 350 °C
|
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EVG Wafer Bonder evbond |
Flexible |
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DISCO Wafer Saw DISCO wafersaw |
Flexible |
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1x4", 1x6" or 1x8" wafer, or pieces | ||||||||||||
Critical Point Dryer Tousimis Automegasamdri-915B cpd |
Flexible |
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AJA Evaporator aja-evap |
Flexible |
0.00 -
300.00 nm
|
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4"x3 or 6"x1 wafers or pieces | |||||||||||
Aixtron MOCVD - III-N system aix-ccs |
Clean (MOCVD) |
0.00 -
5.00 μm
|
400 °C - 1300 °C
|
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4"x1, 2"X3, pieces |