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Carbon Polymer Based

Chemical Formula: 
Various
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Equipment name & Badger ID Technique Cleanliness Primary Materials Etched Other Materials Etched Material Thickness Range Materials Lab Supplied Minimum Resolution Exposure Wavelength Objective Separation Process Temperature Range Gases Substrate Size Substrate Type Maximum Load
Fiji 2
fiji2
Flexible
1 Å - 50 nm
24 °C - 350 °C
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Heidelberg MLA 150
heidelberg
All
405 nm
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1
Heidelberg MLA 150 - 2
heidelberg2
All
375 nm
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1
PDS 2010 LABCOTER™ 2 Parylene Deposition System
parcoater
Flexible
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Samco PC300 Plasma Etch System
samco
Flexible
20 ºC
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Four 4" wafers or two 6" wafers and one 8" wafer
Savannah
savannah
Flexible
1 Å - 50 nm
24 °C - 250 °C
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Woollam
woollam
All
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1