Compound materials with chemical elements from the III and V groups of the periodic table.
Equipment name & NEMO ID | Technique | Cleaning Required | Cleanliness | Material Thickness Range | Materials Lab Supplied | Resist | Process Temperature Range | Chemicals | Gases | Substrate Size | Substrate Type | Maximum Load |
---|---|---|---|---|---|---|---|---|---|---|---|---|
Headway Manual Resist Spinner headway2 |
All |
, , , , , , , , , |
one piece or wafer | |||||||||
Flexus 2320 Stress Tester stresstest |
All |
, , , , , , , , |
1 | |||||||||
Fiji 3 ALD fiji3 |
Flexible |
1.00 Å -
50.00 nm
|
24 °C - 350 °C
|
, , |
||||||||
Fiji 2 ALD fiji2 |
Flexible |
1.00 Å -
50.00 nm
|
24 °C - 350 °C
|
, , , , , , , , , , , , |
||||||||
DISCO Wafer Saw DISCO wafersaw |
Flexible |
, , , , , , , , |
1x4", 1x6" or 1x8" wafer, or pieces | |||||||||
Critical Point Dryer Tousimis Automegasamdri-915B cpd |
Flexible |
, , , , , , , , , |
||||||||||
AJA Evaporator aja-evap |
Flexible |
0.00 -
300.00 nm
|
, , , , , , , , , , , |
4"x3 or 6"x1 wafers or pieces | ||||||||
Aixtron MOCVD - III-V system aix200 |
Pre-Diffusion Clean | Flexible |
0.00 -
5.00 μm
|
300 °C - 800 °C
|
, , , |
4"x1 wafer or 2"x1 wafer or 4 pieces |