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Sapphire

Chemical Formula: 
Al2O3
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Equipment name & NEMO ID Training Required & Charges Cleanliness Locationsort ascending Notes
EVG Wafer Bonder
evbond
Wafer Bonder EVG Training Flexible SNF Cleanroom Paul G Allen L107
Oxford Dielectric Etcher
oxford-rie
Oxford Dielectric Etcher Training Flexible SNF Cleanroom Paul G Allen L107

4" wafers; can be adopted to do 6" or 8" wafers; pieces need to be bonded to carrier wafers

Headway Manual Resist Spinner
headway2
Resist Coat (manual) Headway Manual Training All SNF Cleanroom Paul G Allen L107

Adjustable spin speeds, spin time. SNF-acceptable resists or polymers. Ebeam resists

SVG Develop Track 1
svgdev
SVG Resist Develop tracks 1 and 2 Training All SNF Cleanroom Paul G Allen L107

Automatic development.

Sensofar S-neox
s-neox
Sensofar S-neox Training All SNF Cleanroom Paul G Allen L107

non contact 3D optical profiling

EVG 101 Spray Coater
evgspraycoat
Spray Coater EVG 101 Training All SNF Cleanroom Paul G Allen L107

Spray coating of resists

Tencor P2 Profilometer
p2
Tencor P2 Profilometer Training Clean, Semiclean SNF Cleanroom Paul G Allen L107

Step height measurement range 500 Å to 80 µm

PlasmaTherm Shuttlelock PECVD System
ccp-dep
PlasmaTherm Shuttlelock PECVD System Training All SNF Cleanroom Paul G Allen L107

To maintain cleanliness level, cleans of both the chamber and wafers are required prior to processing -

Substrates in clean category: Pre-Diffusion Clean

For semi-clean substrates: Standard Metal Clean (SRS100 + PRS1000) . Run Chamber clean (no dummies) and conditioning with clean dummies prior to run

SVG Resist Coat Track 1
svgcoat
SVG Resist Coat Tracks 1 and 2 Training All SNF Cleanroom Paul G Allen L107

Automatic Resist spinning and bake

Wet Bench Flexcorr 1
wbflexcorr-1
Wet Bench Flexcorr 1and2 and 3and4 Training Flexible SNF Cleanroom Paul G Allen L107

Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only.

SPTS uetch vapor etch
uetch
SPTS uetch vapor etch Training All SNF Cleanroom Paul G Allen L107

Pieces need a carrier wafer; Isotropic Etching

Prometrix Resistivity Mapping System
prometrix
Prometrix Training All SNF Cleanroom Paul G Allen L107

3 Probe Heads for different cleanliness groups.

Wet Bench Flexcorr 2
wbflexcorr-2
Wet Bench Flexcorr 1and2 and 3and4 Training Flexible SNF Cleanroom Paul G Allen L107

Manual wet etching of non-standard materials. Hot pots available. GaAs allowed in personal labware only

HMDS Vapor Prime Oven, YES
yes
YES Prime Oven Training All SNF Cleanroom Paul G Allen L107

Two programs: Singe and HMDS prime or Singe only. No Resist allowed!

Flexus 2320 Stress Tester
stresstest
Stress Tester Flexus 2320 Training All SNF Cleanroom Paul G Allen L107
Wet Bench Miscellaneous
wbmiscres
Wet Bench Miscellaneous Photoresist Training Flexible SNF Cleanroom Paul G Allen L107

Manual development of resist in beakers and Headway (manual resist spinner). SNF approved developers (acid or base). No solvents!

Oven (White)
white-oven
White Oven Training Flexible SNF Cleanroom Paul G Allen L107

For LOL2000 bake or bakes which are not allowed in the other ovens and need higher temperatures, up to 200C, programmable.

Wet Bench Resist Strip
wbresstrip-1
Wet Bench Resist Strip Clean (Ge), Semiclean, Flexible SNF Cleanroom Paul G Allen L107

Wet Resist Removal: SRS-100 or PRS1000

Oven BlueM 200°C to 430°C
bluem
Blue M Oven Training Flexible SNF Cleanroom Paul G Allen L107

Convection in N2. Cure. Programmable.

SVG Resist Coat Track 2
svgcoat2
SVG Resist Coat Tracks 1 and 2 Training All SNF Cleanroom Paul G Allen L107

Automatic HMDS, Resist spinning, and Bake. AZ5214IR Image Reversal.

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Equipment name & NEMO ID Technique Cleanliness Primary Materials Etched Other Materials Etched Material Thickness Range Materials Lab Supplied Materials User Supplied Process Temperature Range Gases Sample Size Limits Resolution Notes Substrate Size Substrate Type Maximum Load
LEI1500 Contactless Sheet Resistance Mapping
eddycurrent
All 8 in wafer

Sensor Transducer Size is 14 mm diameter 

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1 wafer(2" to 8")
Lesker Sputter
lesker-sputter
Flexible ,
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1 4 inch wafer, 1 6 inch wafer
Lesker2 Sputter
lesker2-sputter
Semiclean
1.00 μm
°C - 800 °C
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one 4 inch wafer, one 6 inch wafer
Matrix Plasma Resist Strip
matrix
Flexible
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25
micromanipulator6000 IV-CV probe station
micromanipulator6000
All ,
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1x4" wafer
Nanospec 210XP
nanospec2
All ,
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Oven (White)
white-oven
Flexible
0 °C - 200 °C
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Oven 110°C post-bake
oven110
All
110 ºC
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Oven 90°C prebake
oven90
All
90 ºC
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Oven BlueM 200°C to 430°C
bluem
Flexible
0 °C - 430 °C
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Oxford Dielectric Etcher
oxford-rie
Flexible
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1
PDS 2010 LABCOTER™ 2 Parylene Deposition System
parcoater
Flexible ,
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PlasmaTherm Shuttlelock PECVD System
ccp-dep
All
100.00 Å - 4.00 μm
100 °C - 350 °C
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4
Profilometer Alphastep 500
alphastep
Flexible ,
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1
Profilometer AlphaStep D-300
alphastep2
Flexible ,
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1
Prometrix Resistivity Mapping System
prometrix
All ,
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1
Samco PC300 Plasma Etch System
samco
Flexible
20 ºC
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Four 4" wafers or two 6" wafers and one 8" wafer
Savannah ALD
savannah
Flexible
1.00 Å - 50.00 nm
24 °C - 250 °C
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SEM -Zeiss Merlin
sem-merlin
All
0.00 mm - 35.00 mm
6 in wafer ,
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Sensofar S-neox
s-neox
All ,
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1

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