Equipment name & NEMO ID | Technique | Cleaning Required | Cleanliness | Material Thickness Range | Materials Lab Supplied | Resist | Process Temperature Range | Chemicals | Gases | Substrate Size | Substrate Type | Maximum Load |
---|---|---|---|---|---|---|---|---|---|---|---|---|
EVG 101 Spray Coater evgspraycoat |
All |
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1 | |||||||||
DISCO Wafer Saw DISCO wafersaw |
Flexible |
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1x4", 1x6" or 1x8" wafer, or pieces | |||||||||
Critical Point Dryer Tousimis Automegasamdri-915B cpd |
Flexible |
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||||||||||
Asylum AFM afm-asylum |
Flexible | |||||||||||
AJA2 Evaporator aja2-evap |
Semiclean |
0.00 -
300.00 nm
|
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4"x3 or 6"x1 wafers or pieces | ||||||||
AJA Evaporator aja-evap |
Flexible |
0.00 -
300.00 nm
|
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4"x3 or 6"x1 wafers or pieces | ||||||||
Aixtron MOCVD - III-V system aix200 |
Pre-Diffusion Clean | Flexible |
0.00 -
5.00 μm
|
300 °C - 800 °C
|
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4"x1 wafer or 2"x1 wafer or 4 pieces | ||||||
Aixtron MOCVD - III-N system aix-ccs |
Clean (MOCVD) |
0.00 -
5.00 μm
|
400 °C - 1300 °C
|
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4"x1, 2"X3, pieces | |||||||
Aixtron Black Magic graphene CVD furnace aixtron-graphene |
Flexible |
800 °C - 1100 °C
|
, |
1x4" wafer or Copper/Nickel foil |