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Sapphire

Chemical Formula: 
Al2O3
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Equipment name & Badger ID Training Required & Chargessort ascending Cleanliness Lab Organization Location Notes
Finetech Lambda
flipchipbonder
Flip Chip Bonder Training Flexible
SNF
SNF Exfab Paul G Allen 104 Stinson
EVG 101 Spray Coater
evgspraycoat
EVG 101 Spray Coater Training All
SNF
SNF Cleanroom Paul G Allen L107

Spray coating of resists

EV Group Contact Aligner
evalign
EV Group Contact Aligner Training All
SNF
SNF Cleanroom Paul G Allen L107

1:1 Contact Aligner.
Anodic Bond, backside align, including IR.

DISCO Wafer Saw
DISCO wafersaw
DISCO wafersaw training Flexible
SNF
SNF Exfab Paul G Allen 159 Capitola
Critical Point Dryer
cpd
Critical Point Dryer Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

CO2 drying after release of micromachined devices

Blue M Oven
bluem
Blue M Oven Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Convection in N2. Cure. Programmable.

ASML PAS 5500/60 i-line Stepper
asml
ASML PAS 5500/60 i-line Stepper Training All
SNF
SNF Cleanroom Paul G Allen L107

5:1 reducing stepper

Alphastep 500 Profilometer
alphastep
Alphastep 500 Profilometer Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

500Å to 300µm

110°C Oven
oven110
110°C Oven Training All
SNF
SNF Cleanroom Paul G Allen L107

Bakes wafers with resist after the development, called post-bake.

90°C Oven
oven90
90°C Oven Training All
SNF
SNF Cleanroom Paul G Allen L107

Bakes wafers after resist coating.

AJA2 Evaporator
aja2-evap
AJA2 Evaporator Semiclean
SNF
SNF Cleanroom Paul G Allen L107

For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance

Aix-ccs
aix-ccs
Aixtron MOCVD - III-N system training Clean (MOCVD)
SNF
SNF MOCVD Paul G Allen 213XA

N and P doping available.
For Si clean: SC1, SC2, HF dip.
For Sapphire clean: SC1, SC2.
For GaN template on Si or Sapphire: Piranha, SC1, SC2.

Savannah
savannah
Savannah Training Flexible
SNF
SNF Cleanroom Paul G Allen L107
Fiji 2
fiji2
Fiji 1 and 2 Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Pages

Equipment name & Badger ID Technique Cleanliness Primary Materials Etched Material Thickness Range Minimum Resolution Resist Developer Objective Separation Process Temperature Range Chemicals Gases Substrate Size Substrate Type Maximum Load
SVG Resist Coat Track 1
svgcoat
All
,
,
,
,
,
,
,
,
25 4 inch wafers
SVG Resist Coat Track 2
svgcoat2
All
,
,
,
,
,
,
,
,
25 4 inch wafers
Tencor P2 Profilometer
p2
Clean, Semiclean
,
,
,
,
,
,
,
,
1
Wet Bench Flexcorr 1
wbflexcorr-1
Flexible
,
,
,
,
,
,
,
,
,
,
Wet Bench Flexcorr 2
wbflexcorr-2
Flexible
,
,
,
,
,
,
,
,
,
,
Wet Bench Flexcorr 3
wbflexcorr-3
Flexible
,
,
,
,
,
,
,
,
,
Wet Bench Flexible Solvents
wbflexsolv
Flexible
,
,
,
,
,
,
,
,
,
,
Wet Bench Flexible Solvents 1
wbflexsolv-1
Flexible
,
,
,
,
,
,
,
,
,
,
Wet Bench Flexible Solvents 2
wbflexsolv-2
Flexible
,
,
,
,
,
,
,
,
,
,
Wet Bench Miscellaneous
wbmiscres
Flexible
,
,
,
,
,
,
,
,
Wet Bench Resist Strip
wbresstrip-1
Clean (Ge), Semiclean, Flexible
20 °C - 60 °C
,
,
,
,
,
,
25 4 inch wafers
White Oven
white-oven
Flexible
0 °C - 200 °C
,
,
,
,
,
,
,
,
Woollam
woollam
All
,
,
,
,
,
,
,
,
,
,
,
,
,
1
Xactix Xenon Difluoride Etcher
xactix
All
,
,
,
,
,
,
,
,
,
1

Pages