AJA Evaporator (aja-evap)
Overview
The AJA e-beam evaporator can be used to directionally deposit various metals. Controllably evaporate a variety of materials, with automatic shutter closing at the defined end thickness. Evaporate Ti, SiO2, Al2O3, Au, Fe, Cr, Ni, Ag, Pt, Al, Pd, NiO, Cu, TiO2, Nb2O5, Ge, Hf, et al. Please check the up-to-date list in Badger comments. Evaporate onto pieces, up to 3 4" wafers, or a 6" wafer, which are transferred into the chamber via a load lock.
Cleanliness:
Processing Technique(s)
Capabilities and Specifications
Lab Supplied Materials
Material Thickness Range: 0.0 - 300.0 nm
Process Temperature Range:
Substrate Type
Substrate Sizes
Maximum Load:
4"x3 or 6"x1 wafers or pieces
Notes:
For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance
Lab Organization, Location, and Badger Information
Lab Organization:
Location:
Badger Area:
nSiL: 155A Venice
Badger ID:
aja-evap
Training and Maintenance
Lab Facility:
Training Charges:
1.00 hours
Primary Trainer:
Primary Maintenance:
Backup Maintenance:
Steps to become a tool user
-
Become a member of SNF.
- Read the relevant operating procedures:
- Shadowing is required. Contact a qualified lab member of the tool to arrange to ‘shadow’. It would be best to find someone who has used the system often. If you don’t know of anyone, you may check reservations or history to find a qualified user. We recommend that you be with the lab member for the full time while operating the tool and ask lots of questions during the shadowing. You may have to shadow a qualified user more than one time to be comfortable with the tool. Please follow the instructions on this form: Shadowing at SNF
- Sign up for the relevant training scheduled in .
- Contact the primary trainer: for a written test and then schedule the final group training.
Notes:
two shadowing sessions and a written test before training with tool owner
