Equipment name & Badger ID | Technique | Cleaning Required | Cleanliness | Material Thickness Range | Materials Lab Supplied | Materials User Supplied | Minimum Resolution | Exposure Wavelength | Mask Size | Max Exposure Area | Resist | Objective Separation | Process Temperature Range | Chemicals | Gases | Sample Size Limits | Resolution Notes | Substrate Size | Substrate Type | Maximum Load |
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Aixtron MOCVD - III-V system aix200 |
Pre-Diffusion Clean | Flexible |
0 -
5 μm
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|
300 °C - 800 °C
|
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4"x1 wafer or 2"x1 wafer or 4 pieces | ||||||||||||
AJA Evaporator aja-evap |
Flexible |
0 -
300 nm
|
|
|
|
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4"x3 or 6"x1 wafers or pieces | |||||||||||||
Alphastep 500 Profilometer alphastep |
Flexible |
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1 | |||||||||||||
DISCO Wafer Saw DISCO wafersaw |
Flexible |
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|
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1x4", 1x6" or 1x8" wafer, or pieces | |||||||||||||
Flexus 2320 Stress Tester stresstest |
All |
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1 | |||||||||||||
Headway Manual Resist Spinner headway2 |
All |
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one piece or wafer | |||||||||||||
Heidelberg MLA 150 heidelberg |
All |
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|
405 nm |
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1 | ||||||||||||
Heidelberg MLA 150 - 2 heidelberg2 |
All |
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375 nm |
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1 | ||||||||||||
HMDS Vapor Prime Oven, YES yes |
All |
|
|
|
150 ºC
|
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Karl Suss MA-6 Contact Aligner 1 karlsuss |
All |
|
|
365 nm | 4 inch, 5 inch, 7 inch | 5 inch mask = 4 inch, 7 inch mask = 6 inch, 4 inch mask = 3 inch |
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Karl Suss MA-6 Contact Aligner 2 karlsuss2 |
All |
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|
365 nm or 405 nm | 4 inch, 5 inch, 7 inch | 5 inch mask = 4 inch, 7 inch mask = 6 inch, 4 inch mask = 3 inch |
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Keyence Digital Microscope VHX-6000 keyence |
All |
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Lakeshore Hall Measurement System LakeshoreHall |
All |
100 μm -
1000 μm
|
|
|
-258 °C - 1000 °C
|
8 in wafer |
Sensor Transducer Size is 14 mm diameter |
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1 piece | |||||||||||
LEI1500 Contactless Sheet Resistance Mapping eddycurrent |
All |
|
|
|
|
8 in wafer |
Sensor Transducer Size is 14 mm diameter |
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1 wafer(2" to 8") | |||||||||||
Lesker Sputter lesker-sputter |
Flexible |
|
|
|
|
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1 4 inch wafer, 1 6 inch wafer | |||||||||||||
Lesker2 Sputter lesker2-sputter |
Semiclean |
1 μm
|
|
|
°C - 800 °C
|
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one 4 inch wafer, one 6 inch wafer | |||||||||||||
Lithography Solvent Bench lithosolv |
Flexible |
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micromanipulator6000 IV-CV probe station micromanipulator6000 |
All |
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1x4" wafer | |||||||||||||
Nanospec 210XP nanospec2 |
All |
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Oven 110°C post-bake oven110 |
All |
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110 ºC
|
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