The "Flexible" cleanliness group is part of the SNF/ExFab contamination policy.
The following is a list of equipment that fall into the "Flexible" category.
Equipment name & NEMO ID | Training Required & Charges | Cleanliness | Location | Notes |
---|---|---|---|---|
CytoViva HSI cytoviva |
Cytoviva Training | Flexible | SNF Exfab Paul G Allen 151 Ocean | |
Critical Point Dryer Tousimis Automegasamdri-915B cpd |
Critical Point Dryer Training | Flexible | SNF Cleanroom Paul G Allen L107 |
CO2 drying after release of micromachined devices |
Tystar Bank 1 Tube 2 B1T2 Flexible Oxide Anneal |
Tystar Atmospheric Tube Training | Flexible | SNF Cleanroom Paul G Allen L107 | |
MRC Reactive Ion Etcher mrc |
MRC Reactive Ion Etcher Training | Flexible | SNF Cleanroom Paul G Allen L107 |
Typically used for sputter etching; Single wafer, direct load system; wafers/ pieces can be directly placed on electrode |
Tystar Bank 1 Tube 1 B1T1 Flexible Oxide |
Tystar Atmospheric Tube Training | Flexible | SNF Cleanroom Paul G Allen L107 | |
Plasma Therm Versaline LL ICP Metal Etcher PT-MTL |
Plasma Therm Versaline LL ICP Metal Etcher Training | Flexible | SNF Cleanroom Paul G Allen L107 |
Single wafer; Default 4" config; Can be converted to 6" config; pieces need to be attached to carrier wafer; Restrictions: Can not etch metals or metal oxides with no volatile by-products (shorting & arcing issues) |
Matrix Plasma Resist Strip matrix |
Matrix Plasma Resist Strip Training | Flexible | SNF Cleanroom Paul G Allen L107 |
Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Chuck temperature controls wafer heating. |
Plasma Therm Versaline LL ICP Deep Silicon Etcher PT-DSE |
Plasma Therm Versaline LL ICP Deep Silicon Etcher Training | Flexible | SNF Cleanroom Paul G Allen L107 |
Single wafer; Bosch process for Si etching; Default 4" config; Can be converted to 6" config; pieces need to be attached to carrier wafer; need a support wafer for through wafer etching, can be used for Isotropic Si Etching |
Oxford Dielectric Etcher oxford-rie |
Oxford Dielectric Etcher Training | Flexible | SNF Cleanroom Paul G Allen L107 |
4" wafers; can be adopted to do 6" or 8" wafers; pieces need to be bonded to carrier wafers |
Wet Bench Flexcorr 1 wbflexcorr-1 |
Wet Bench Flexcorr 1and2 and 3and4 Training | Flexible | SNF Cleanroom Paul G Allen L107 |
Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only. |
Plasma Therm Versaline LL ICP Dielectric Etcher PT-Ox |
Plasma Therm Versaline LL ICP Dielectric Etcher Training | Flexible | SNF Cleanroom Paul G Allen L107 |
Single wafer; Default 4" config; Can be converted to 6" config; pieces need to be attached to carrier wafer; Restrictions: Can not etch metals or metal oxides with no volatile by-products (shorting & arcing issues) |
Wet Bench Flexcorr 2 wbflexcorr-2 |
Wet Bench Flexcorr 1and2 and 3and4 Training | Flexible | SNF Cleanroom Paul G Allen L107 |
Manual wet etching of non-standard materials. Hot pots available. GaAs allowed in personal labware only |
Oven (White) white-oven |
White Oven Training | Flexible | SNF Cleanroom Paul G Allen L107 |
For LOL2000 bake or bakes which are not allowed in the other ovens and need higher temperatures, up to 200C, programmable. |
Wet Bench Miscellaneous wbmiscres |
Wet Bench Miscellaneous Photoresist Training | Flexible | SNF Cleanroom Paul G Allen L107 |
Manual development of resist in beakers and Headway (manual resist spinner). SNF approved developers (acid or base). No solvents! |
Oven BlueM 200°C to 430°C bluem |
Blue M Oven Training | Flexible | SNF Cleanroom Paul G Allen L107 |
Convection in N2. Cure. Programmable. |
Wet Bench Resist Strip wbresstrip-1 |
Wet Bench Resist Strip | Clean (Ge), Semiclean, Flexible | SNF Cleanroom Paul G Allen L107 |
Wet Resist Removal: SRS-100 or PRS1000 |
Tylan9 Forming Gas Anneal Furnace tylan9 |
Forming Gas Anneal Furnace Training | Flexible | SNF Cleanroom Paul G Allen L107 |
Any material that won't vaporize is okay. N2 and Ar annealing available. |
Fiji 2 ALD fiji2 |
ALD Fiji 1 and 2 Training | Flexible | SNF Cleanroom Paul G Allen L107 | |
Wet Bench Flexcorr 4 wbflexcorr-4 |
Wet Bench Flexcorr 1and2 and 3and4 Training | Flexible | SNF Cleanroom Paul G Allen L107 |
Manual wet etching of non-standard materials using acids or bases. Hot plate, HF bath, and controlled temperature bath available. GaAs not allowed. |
RTA AllWin 610 aw610_r |
AllWin 610 RTA Training | Flexible | SNF Cleanroom Paul G Allen L107 |
Equipment name & NEMO ID | Technique | Cleanliness | Primary Materials Etched | Other Materials Etched | Material Thickness Range | Materials Lab Supplied | Process Temperature Range | Gases | Substrate Size | Substrate Type | Maximum Load |
---|---|---|---|---|---|---|---|---|---|---|---|
Oven (White) white-oven |
Flexible |
0 °C - 200 °C
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Oven BlueM 200°C to 430°C bluem |
Flexible |
0 °C - 430 °C
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Oxford Dielectric Etcher oxford-rie |
Flexible |
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1 | ||||||||
Oxford III-V etcher Ox-35 |
Flexible | 1 | |||||||||
PDMS Hotplate hotplate-1 |
Flexible | ||||||||||
PDMS Spin Coater spincoat-g3p8 |
Flexible | ||||||||||
PDMS Workbench | Flexible | ||||||||||
PDS 2010 LABCOTER™ 2 Parylene Deposition System parcoater |
Flexible |
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Plasma Therm Versaline LL ICP Deep Silicon Etcher PT-DSE |
Flexible | 1 | |||||||||
Plasma Therm Versaline LL ICP Dielectric Etcher PT-Ox |
Flexible | 1 | |||||||||
Plasma Therm Versaline LL ICP Metal Etcher PT-MTL |
Flexible | 1 | |||||||||
Plasmaetch PE-50 plasma-etch |
Flexible | Multiple | |||||||||
Profilometer Alphastep 500 alphastep |
Flexible |
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1 | ||||||||
Profilometer AlphaStep D-300 alphastep2 |
Flexible |
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1 | ||||||||
QSonica Q700 Sonicator sonicator |
Flexible | ||||||||||
RTA AllWin 610 aw610_r |
Flexible |
21 °C - 1150 °C
|
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Samco PC300 Plasma Etch System samco |
Flexible |
20 ºC
|
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Four 4" wafers or two 6" wafers and one 8" wafer | |||||||
Savannah ALD savannah |
Flexible |
1.00 Å -
50.00 nm
|
24 °C - 250 °C
|
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Sinton Lifetime Tester sinton-lifetime-tester |
Flexible | ||||||||||
Solidscape Wax 3D Printer 3d-wax-printer |
Flexible |