Equipment name & NEMO ID | Technique | Cleaning Required | Cleanliness | Primary Materials Etched | Other Materials Etched | Material Thickness Range | Materials Lab Supplied | Process Temperature Range | Gases | Sample Size Limits | Substrate Size | Substrate Type | Maximum Load |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
SEM -Zeiss Merlin sem-merlin |
All |
0.00 mm -
35.00 mm
|
6 in wafer |
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Savannah ALD savannah |
Flexible |
1.00 Å -
50.00 nm
|
24 °C - 250 °C
|
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Samco PC300 Plasma Etch System samco |
Flexible |
20 ºC
|
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Four 4" wafers or two 6" wafers and one 8" wafer | |||||||||
RTA AllWin 610 aw610_r |
Flexible |
21 °C - 1150 °C
|
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RTA AllWin 610 aw610_l |
Pre-Diffusion Clean | Clean |
21 °C - 1150 °C
|
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1 wafer | ||||||||
Profilometer AlphaStep D-300 alphastep2 |
Flexible |
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1 | ||||||||||
Profilometer Alphastep 500 alphastep |
Flexible |
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1 | ||||||||||
PlasmaTherm Versaline HDP CVD System hdpcvd |
All |
500.00 Å -
4.00 μm
|
50 °C - 150 °C
|
1 | |||||||||
PlasmaTherm Shuttlelock PECVD System ccp-dep |
All |
100.00 Å -
4.00 μm
|
100 °C - 350 °C
|
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4 | ||||||||
Plasmaetch PE-50 plasma-etch |
Flexible | Multiple | |||||||||||
PDS 2010 LABCOTER™ 2 Parylene Deposition System parcoater |
Flexible |
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Oven BlueM 200°C to 430°C bluem |
Flexible |
0 °C - 430 °C
|
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Oven 90°C prebake oven90 |
All |
90 ºC
|
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Oven 110°C post-bake oven110 |
All |
110 ºC
|
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Oven (White) white-oven |
Flexible |
0 °C - 200 °C
|
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Optomec Printer optomec-printer |
Flexible | ||||||||||||
Nanospec 3 nanospec3 |
All | ||||||||||||
Nanospec 210XP nanospec2 |
All |
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MVD mvd |
Flexible |
1.00 Å -
50.00 nm
|
24 °C - 150 °C
|
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MRC Reactive Ion Etcher mrc |
Flexible | 1 |