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Equipment name & NEMO ID Training Required & Chargessort ascending Cleanliness Location Notes
RTA AllWin 610
aw610_r
AllWin 610 RTA Training Flexible SNF Cleanroom Paul G Allen L107
Oven 110°C post-bake
oven110
Resist Postbake Oven 110°C Training All SNF Cleanroom Paul G Allen L107

Bakes wafers with resist after the development, called post-bake.

Asylum AFM
afm-asylum
AFM Asylum Training Flexible SNF Exfab Paul G Allen 151 Ocean
Oven 90°C prebake
oven90
Resist Prebake Oven 90°C Training All SNF Cleanroom Paul G Allen L107

Bakes wafers after resist coating.

AJA2 Evaporator
aja2-evap
Evaporator AJA2 Semiclean SNF Cleanroom Paul G Allen L107

For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance

Aixtron MOCVD - III-V system
aix200
MOCVD - III-V Aixtron training Flexible SNF MOCVD Paul G Allen 213XA

N and P doping available.
For Si clean: SC1, SC2, HF dip.
For III-V clean: HCl or HF dip.

Aixtron MOCVD - III-N system
aix-ccs
MOCVD - III-N Aixtron training Clean (MOCVD) SNF MOCVD Paul G Allen 213XA

N and P doping available.
For Si clean: SC1, SC2, HF dip.
For Sapphire clean: SC1, SC2.
For GaN template on Si or Sapphire: Piranha, SC1, SC2.

Aixtron Black Magic graphene CVD furnace
aixtron-graphene
CVD graphene furnace Aixtron Black Magic training Flexible SNF Exfab Paul G Allen L119 Año Nuevo
MVD
mvd
MVD Training Flexible SNF Cleanroom Paul G Allen L107

Reactor located inside glovebox

Savannah ALD
savannah
ALD Savannah Training Flexible SNF Cleanroom Paul G Allen L107
Fiji 3 ALD
fiji3
ALD Fiji 3 Training Flexible SNF Cleanroom Paul G Allen L107

Restricted to non-conductive films only

Fiji 2 ALD
fiji2
ALD Fiji 1 and 2 Training Flexible SNF Cleanroom Paul G Allen L107
Fiji 1 ALD
fiji1
ALD Fiji 1 and 2 Training Semiclean SNF Cleanroom Paul G Allen L107

Pages

Equipment name & NEMO ID Technique Cleaning Required Cleanliness Primary Materials Etched Other Materials Etched Material Thickness Range Developer Process Temperature Range Chemicals Gases Substrate Size Substrate Type Maximum Load
Tylanfga Forming Gas Anneal Furnace
tylanfga
Standard Metal Clean Semiclean
100.00 Å - 100.00 Å
250 °C - 800 °C
50
Wet Bench Flexcorr 1
wbflexcorr-1
Flexible ,
,
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,
Wet Bench Flexcorr 2
wbflexcorr-2
Flexible ,
,
,
,
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,
Wet Bench Flexcorr 3
wbflexcorr-3
Flexible ,
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,
Wet Bench Flexcorr 4
wbflexcorr-4
Flexible
Wet Bench Flexible Solvents
wbflexsolv
Flexible ,
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Wet Bench Flexible Solvents 1
wbflexsolv-1
Flexible ,
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Wet Bench Flexible Solvents 2
wbflexsolv-2
Flexible ,
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Wet Bench Miscellaneous
wbmiscres
Flexible ,
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Wet Bench Resist Strip
wbresstrip-1
Clean (Ge), Semiclean, Flexible
20 °C - 60 °C
,
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25 4 inch wafers
Wet Bench Solvent Lithography
lithosolv
Flexible ,
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Woollam
woollam
All ,
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1
Xactix Xenon Difluoride Etcher
xactix
All ,
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1

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