SPTS uetch vapor etch uetch |
SPTS uetch vapor etch Training |
All |
SNF Cleanroom Paul G Allen L107 |
Pieces need a carrier wafer; Isotropic Etching
|
Sensofar S-neox s-neox |
Sensofar S-neox Training |
All |
SNF Cleanroom Paul G Allen L107 |
non contact 3D optical profiling
|
AJA2 Evaporator aja2-evap |
Evaporator AJA2 |
Semiclean |
SNF Cleanroom Paul G Allen L107 |
For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance
|
Fiji 3 ALD fiji3 |
ALD Fiji 3 Training |
Flexible |
SNF Cleanroom Paul G Allen L107 |
Restricted to non-conductive films only
|
Wet Bench Decontamination wbdecon |
Wet Bench Decontamination Training |
Clean |
SNF Cleanroom Paul G Allen L107 |
KOH or wafersaw or post-cmp decontamination
|
HMDS Vapor Prime Oven, YES yes |
YES Prime Oven Training |
All |
SNF Cleanroom Paul G Allen L107 |
Two programs: Singe and HMDS prime or Singe only. No Resist allowed!
|
Tencor P2 Profilometer p2 |
Tencor P2 Profilometer Training |
Clean, Semiclean |
SNF Cleanroom Paul G Allen L107 |
Step height measurement range 500 Å to 80 µm
|
Savannah ALD savannah |
ALD Savannah Training |
Flexible |
SNF Cleanroom Paul G Allen L107 |
|
Wet Bench Solvent Lithography lithosolv |
Lithography Solvent Bench Training |
Flexible |
SNF Cleanroom Paul G Allen L107 |
Manual solvent cleaning of substrates or masks. Teflon coated metal tweezers cleaning.
|
Oven (White) white-oven |
White Oven Training |
Flexible |
SNF Cleanroom Paul G Allen L107 |
For LOL2000 bake or bakes which are not allowed in the other ovens and need higher temperatures, up to 200C, programmable.
|
LEI1500 Contactless Sheet Resistance Mapping eddycurrent |
LEI1500 Contactless Sheet Resistance Mapping Training |
All |
SNF Exfab Paul G Allen 151 Ocean |
|
Lakeshore Hall Measurement System LakeshoreHall |
Lakeshore Hall Measurement System training |
All |
SNF Exfab Paul G Allen 151 Ocean |
|
micromanipulator6000 IV-CV probe station micromanipulator6000 |
micromanipulator6000 IV-CV probe station Training |
All |
SNF Exfab Paul G Allen 151 Ocean |
|
DISCO Wafer Saw DISCO wafersaw |
Wafersaw DISCO training |
Flexible |
SNF Exfab Paul G Allen 159 Capitola |
|
Lesker Sputter lesker-sputter |
Sputter Lesker 1&2 Training |
Flexible |
SNF Exfab Paul G Allen 155A Venice |
reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter
|
AJA Evaporator aja-evap |
Evaporator AJA training |
Flexible |
SNF Exfab Paul G Allen 155A Venice |
For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance
|
First Nano carbon nanotube CVD furnace cvd-nanotube |
cvd-nanotube training |
Flexible |
SNF Exfab Paul G Allen L119 Año Nuevo |
Aligned single-walled carbon nanotube growth with ST-cut quartz substrates (available from SNF stockroom);1-15 single-walled carbon nanotubes per micron density
|
Aixtron Black Magic graphene CVD furnace aixtron-graphene |
CVD graphene furnace Aixtron Black Magic training |
Flexible |
SNF Exfab Paul G Allen L119 Año Nuevo |
|
Aixtron MOCVD - III-N system aix-ccs |
MOCVD - III-N Aixtron training |
Clean (MOCVD) |
SNF MOCVD Paul G Allen 213XA |
N and P doping available.
For Si clean: SC1, SC2, HF dip.
For Sapphire clean: SC1, SC2.
For GaN template on Si or Sapphire: Piranha, SC1, SC2.
|
Aixtron MOCVD - III-V system aix200 |
MOCVD - III-V Aixtron training |
Flexible |
SNF MOCVD Paul G Allen 213XA |
N and P doping available.
For Si clean: SC1, SC2, HF dip.
For III-V clean: HCl or HF dip.
|