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Flexible

The "Flexible" cleanliness group is part of the SNF/ExFab contamination policy.

The following is a list of equipment that fall into the "Flexible" category.

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Equipment name & NEMO ID Training Required & Charges Cleanliness Locationsort ascending Notes
Fiji 3 ALD
fiji3
ALD Fiji 3 Training Flexible SNF Cleanroom Paul G Allen L107

Restricted to non-conductive films only

Wet Bench Flexible Solvents 1
wbflexsolv-1
Wet Bench Flexible Solvents 1 and 2 Training Flexible SNF Cleanroom Paul G Allen L107

Manual solvent cleaning, two ultrasonic baths.

MVD
mvd
MVD Training Flexible SNF Cleanroom Paul G Allen L107

Reactor located inside glovebox

Wet Bench Flexible Solvents 2
wbflexsolv-2
Wet Bench Flexible Solvents 1 and 2 Training Flexible SNF Cleanroom Paul G Allen L107

Manual solvent cleaning, hot plate

Savannah ALD
savannah
ALD Savannah Training Flexible SNF Cleanroom Paul G Allen L107
Wet Bench Solvent Lithography
lithosolv
Lithography Solvent Bench Training Flexible SNF Cleanroom Paul G Allen L107

Manual solvent cleaning of substrates or masks. Teflon coated metal tweezers cleaning.

Technics Asher
technics
Technics Asher Training Flexible SNF Cleanroom Paul G Allen L107
Wet Bench Flexcorr 3
wbflexcorr-3
Wet Bench Flexcorr 1and2 and 3and4 Training Flexible SNF Cleanroom Paul G Allen L107

Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed.

EVG Wafer Bonder
evbond
Wafer Bonder EVG Training Flexible SNF Cleanroom Paul G Allen L107
Samco PC300 Plasma Etch System
samco
Samco Training Flexible SNF Cleanroom Paul G Allen L107
Oxford III-V etcher
Ox-35
Oxford III-V etcher Training Flexible SNF Cleanroom Paul G Allen L107

Metal etching or  Metal hard masks are not allowed. 4" wafers; can be adopted to do 6" or 8" wafers; pieces need to be bonded to carrier wafers; Restrictions: III-V materials only.

Wet Bench Flexible Solvents
wbflexsolv
Wet Bench Flexible Solvents 1 and 2 Training Flexible SNF Cleanroom Paul G Allen L107

Manual solvent cleaning of substrates or resist removal.

Ex Fab Develop Wet Bench
wbexfab_dev
WbExfab_Dev Training Flexible SNF Exfab Paul G Allen 104 Stinson

Manual development of resist in beakers. SNF approved developers only. No solvents!

Nanoscribe Photonics GT
nanoscribe
Nanoscribe Photonics GT Training Flexible SNF Exfab Paul G Allen 104 Stinson
Ex Fab Solvent Wet Bench
wbexfab_solv
WbExfab_Solv Training Flexible SNF Exfab Paul G Allen 104 Stinson
Finetech Lambda
flipchipbonder
Flip Chip Bonder Training Flexible SNF Exfab Paul G Allen 104 Stinson
Profilometer Alphastep 500
alphastep
Alphastep 500 Profilometer Training Flexible SNF Exfab Paul G Allen 104 Stinson

500Å to 300µm

Profilometer AlphaStep D-300
alphastep2
AlphaStep2 Training Flexible SNF Exfab Paul G Allen 104 Stinson

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Equipment name & NEMO ID Technique Cleanliness Primary Materials Etched Other Materials Etched Material Thickness Range Materials Lab Supplied Developer Process Temperature Range Chemicals Gases Substrate Size Substrate Type Maximum Load
Technics Asher
technics
Flexible
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Four 4" wafers to pieces, one 6" or 8" wafer
Thermoscientific Oven
thermoscientific-oven
Flexible
Thinky AR-100 Mixer
thinky-mixer
Flexible
Tylan9 Forming Gas Anneal Furnace
tylan9
Flexible
250 °C - 1100 °C
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50
Tystar Bank 1 Tube 1
B1T1 Flexible Oxide
Flexible
25.00 Å - 2.00 μm
400 °C - 1100 °C
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100
Tystar Bank 1 Tube 2
B1T2 Flexible Oxide Anneal
Flexible
25.00 Å - 2.00 μm
400 °C - 1100 °C
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100
Voltera
voltera
Flexible
Wet Bench Flexcorr 1
wbflexcorr-1
Flexible ,
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Wet Bench Flexcorr 2
wbflexcorr-2
Flexible ,
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Wet Bench Flexcorr 3
wbflexcorr-3
Flexible ,
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Wet Bench Flexcorr 4
wbflexcorr-4
Flexible
Wet Bench Flexible Solvents
wbflexsolv
Flexible ,
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Wet Bench Flexible Solvents 1
wbflexsolv-1
Flexible ,
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Wet Bench Flexible Solvents 2
wbflexsolv-2
Flexible ,
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Wet Bench Miscellaneous
wbmiscres
Flexible ,
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Wet Bench Resist Strip
wbresstrip-1
Clean (Ge), Semiclean, Flexible
20 °C - 60 °C
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25 4 inch wafers
Wet Bench Solvent Lithography
lithosolv
Flexible ,
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Xplore Micro Compounder
N/A
Flexible
0 °C - 400 °C

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