PlasmaTherm Shuttlelock PECVD System (ccp-dep)
Capabilities and Specifications
Material Thickness Range: 100.0 Å - 4.0 μm
Process Temperature Range:
To maintain cleanliness level, cleans of both the chamber and wafers are required prior to processing -
Substrates in clean category: Pre-Diffusion Clean
For semi-clean substrates: Standard Metal Clean (SRS100 + PRS1000) . Run Chamber clean (no dummies) and conditioning with clean dummies prior to run
Lab Facility, Location, and Badger Information
Training and Maintenance
Steps to become a tool user
Check the training calendar for any scheduled training:
Read the relevant operating procedures:
You can also shadow an experienced user to get qualified on this tool. Complete the shadowing form. Get the form signed by the trainer.
After attending the training with an experienced user, submit the completed shadowing form to the primary trainer. If the primary trainer is the one who trained you, no need to fill out the shadowing form. Get qualified.