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PlasmaTherm Shuttlelock PECVD System (ccp-dep)



Capabilities and Specifications

Cleaning Required: 
Material Thickness Range: 100.0 Å - 4.0 μm
Process Temperature Range: 
100 °C - 350 °C
Maximum Load: 

To maintain cleanliness level, cleans of both the chamber and wafers are required prior to processing -

Substrates in clean category: Pre-Diffusion Clean

For semi-clean substrates: Standard Metal Clean (SRS100 + PRS1000) . Run Chamber clean (no dummies) and conditioning with clean dummies prior to run

Lab Organization, Location, and Badger Information

Training and Maintenance

Lab Facility: 
Training Charges: 
1.00 hours
Primary Trainer: 
Primary Maintenance: 
Backup Maintenance: 

Steps to become a tool user

  1. Become a member of SNF.
  1. Check the training calendar for any scheduled training: .
  2. Contact the primary trainer, , to sign up for the training or to schedule a training if none is scheduled.
  3. Read the relevant operating procedures:
  4. After attending the training with an experienced user, submit the completed shadowing form to the primary trainer.  If the primary trainer is the one who trained you, no need to fill out the shadowing form.  Get qualified.