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PlasmaTherm Shuttlelock PECVD System (ccp-dep)

Overview

Cleanliness: 
All

Processing Technique(s)

Capabilities and Specifications

Cleaning Required: 
Special: See Notes
Material Thickness Range: 100.0 Å - 4.0 μm
Process Temperature Range: 
100 °C - 350 °C
Maximum Load: 
4
Notes: 

To maintain cleanliness level, cleans of both the chamber and wafers are required prior to processing -

Substrates in clean category: Pre-Diffusion Clean

For semi-clean substrates: Standard Metal Clean (SRS100 + PRS1000) . Run Chamber clean (no dummies) and conditioning with clean dummies prior to run

Lab Facility, Location, and Badger Information

Lab Organization: 
Stanford Nanofabrication Facility Cleanroom (SNF Cleanroom)
Location: 
SNF Cleanroom Paul G Allen L107
Badger ID: 
ccp-dep

Training and Maintenance

Lab Facility: 
SNF Cleanroom
Training Charges: 
1.00 hours
Primary Trainer: 
Mary Tang
Primary Maintenance: 
Elmer Enriquez
Backup Maintenance: 
Mike Dickey

Steps to become a tool user

  1. Become a member of SNF.
  1. Check the training calendar for any scheduled training:
    .
  2. Contact the primary trainer,
    , to sign up for the training or to schedule a training if none is scheduled.
  3. Read the relevant operating procedures:
  4. You can also shadow an experienced user to get qualified on this tool. Complete the shadowing form. Get the form signed by the trainer.
  5. After attending the training with an experienced user, submit the completed shadowing form to the primary trainer.  If the primary trainer is the one who trained you, no need to fill out the shadowing form.  Get qualified.