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SiNx PECVD and Nanostructure Etching Recipe Development
Project Type:
E241
Date:
June 2014
Areas of Interest:
PECVD SiNx stress, Nanosphere etching
Report(s):
SiNx PECVD and Nanostructure Etching Recipe Development- Final Report
Processing Technique (former Function and Method):
Plasma Enhanced (PE) CVD
Dry Etching
Researchers and (Mentors):
Yusi Chen and Muyu Xue
List of Important Equipment:
PlasmaTherm Shuttlelock PECVD System (ccp-dep)
Plasma Therm Versaline LL ICP Dielectric Etcher (PT-Ox)
Presentation(s):
SiNx Deposition and Etching recipe Development- Final Presentation