AJA2 Evaporator (aja2-evap)
Overview
The AJA e-beam evaporator can be used to directionally deposit various metals. Controllably evaporate a variety of materials, with automatic shutter closing at the defined end thickness. Evaporate Ti, Cr, Ag, Pt, Al, Pd, Cu, Hf, et al. Please check the up-to-date list in Badger comments. Evaporate onto pieces, up to three 4" wafers, or a 6" wafer, which are transferred into the chamber via a load lock. The process chamber is equipped with an ion gun, capable of sputter ething your substrate.
Cleanliness:
Processing Technique(s)
Capabilities and Specifications
Lab Supplied Materials
Material Thickness Range: 0.0 - 300.0 nm
Substrate Type
Substrate Sizes
Maximum Load:
4"x3 or 6"x1 wafers or pieces
Notes:
For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance
Lab Organization, Location, and NEMO Information
Lab Organization:
Location:
NEMO Area:
nSiL: Cleanroom
NEMO ID:
aja2-evap
Training and Maintenance
Lab Facility:
Training Charges:
1.00 hours
Primary Trainer:
Primary Maintenance:
Backup Maintenance:
Steps to become a tool user
-
Become a member of SNF.
- with two shadowing sessions and a written test before training
