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AJA2 Evaporator (aja2-evap)

Overview

The AJA e-beam evaporator can be used to directionally deposit various metals. Controllably evaporate a variety of materials, with automatic shutter closing at the defined end thickness. Evaporate Ti, Cr, Ag, Pt, Al, Pd, Cu, Hf,  et al. Please check the up-to-date list in Badger comments. Evaporate onto pieces, up to three 4" wafers, or a 6" wafer, which are transferred into the chamber via a load lock. The process chamber is equipped with an ion gun, capable of sputter ething your substrate.

Cleanliness: 

Capabilities and Specifications

Material Thickness Range: 0.0 - 300.0 nm
Process Temperature Range: 
Maximum Load: 
4"x3 or 6"x1 wafers or pieces
Notes: 

For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance

Lab Facility, Location, and Badger Information

Training and Maintenance

Lab Facility: 
Training Charges: 
1.00 hours
Primary Trainer: 
Primary Maintenance: 
Backup Maintenance: 

Steps to become a tool user

  1. Become a member of SNF.
Notes: 

with two shadowing sessions and a written test before training