The AJA e-beam evaporator can be used to directionally deposit various metals. Controllably evaporate a variety of materials, with automatic shutter closing at the defined end thickness. Evaporate Ti, Cr, Ag, Pt, Al, Pd, Cu, Hf, et al. Please check the up-to-date list in Badger comments. Evaporate onto pieces, up to three 4" wafers, or a 6" wafer, which are transferred into the chamber via a load lock. The process chamber is equipped with an ion gun, capable of sputter ething your substrate.
For more than 300nm deposition, please contact Graham Ewing<firstname.lastname@example.org> in advance
with two shadowing sessions and a written test before training