Lesker2 Sputter (lesker2-sputter)
Lesker2 is a load locked single wafer metal sputter providing semi-clean processing options for semi-clean compatible materials. The eight gun magnetron Lesker is classified as semi-clean and provides non-directional thin film (< 1 um)
Capabilities and Specifications
Material Thickness Range: - 1.0 μm
Process Temperature Range:
one 4 inch wafer, one 6 inch wafer
reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter
Lab Facility, Location, and Badger Information
Training and Maintenance
Steps to become a tool user
Read the relevant operating procedures:
Contact a qualified user of the tool to arrange to ‘shadow’. It would be best to find someone who has used the system often. If you don’t know of anyone, you may check reservations or history to find a qualified user. You may also contact the Discussion Lists
. We recommend that you be with the lab member for the full time while operating the tool and ask lots of questions during the shadowing. You may have to shadow a qualified user more than one time to be comfortable with the tool.
Print the SNF Training Shadowing Form
on clean room paper.
For Lesker 2: Please contact Graham Ewing for training after completing all of the Lesker training steps.