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Lesker2 Sputter (lesker2-sputter)

Overview

Lesker2-Sputter

Lesker2 is a load locked single wafer metal sputter providing semi-clean processing options for semi-clean compatible materials. The eight gun magnetron Lesker is classified as semi-clean and provides non-directional thin film (< 1 um)

Cleanliness: 

Capabilities and Specifications

Material Thickness Range: - 1.0 μm
Process Temperature Range: 
°C - 800 °C
Maximum Load: 
one 4 inch wafer, one 6 inch wafer
Notes: 

reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter

Lab Organization, Location, and Badger Information

Badger Area: 
nSiL: Cleanroom
Badger ID: 
lesker2-sputter

Training and Maintenance

Lab Facility: 
Training Charges: 
1.00 hours
Primary Trainer: 
Primary Maintenance: 

Steps to become a tool user

  1. Become a member of SNF.
  1. Read the relevant operating procedures:
  2. Shadowing is required. Contact a qualified lab member of the tool to arrange to ‘shadow’. It would be best to find someone who has used the system often. If you don’t know of anyone, you may check reservations or history to find a qualified user. We recommend that you be with the lab member for the full time while operating the tool and ask lots of questions during the shadowing. You may have to shadow a qualified user more than one time to be comfortable with the tool. Please follow the instructions on this form: Shadowing at SNF
  3. Contact the primary trainer: .

Operating Instructions