Skip to content Skip to navigation

Lesker2 Sputter (lesker2-sputter)



Lesker2 is a load locked single wafer metal sputter providing semi-clean processing options for semi-clean compatible materials. The eight gun magnetron Lesker is classified as semi-clean and provides non-directional thin film (< 1 um)


Capabilities and Specifications

Material Thickness Range: - 1.0 μm
Process Temperature Range: 
°C - 800 °C
Maximum Load: 
one 4 inch wafer, one 6 inch wafer

reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter

Lab Facility, Location, and Badger Information

Badger Area: 
Badger ID: 

Training and Maintenance

Lab Facility: 
Training Charges: 
1.00 hours
Primary Trainer: 
Primary Maintenance: 

Steps to become a tool user

  1. Become a member of SNF.
  1. Read the relevant operating procedures:
  2. Shadowing: Contact a qualified user of the tool to arrange to ‘shadow’. It would be best to find someone who has used the system often. If you don’t know of anyone, you may check reservations or history to find a qualified user. You may also contact the . We recommend that you be with the lab member for the full time while operating the tool and ask lots of questions during the shadowing. You may have to shadow a qualified user more than one time to be comfortable with the tool.
    Print the SNF Training Shadowing Form on clean room paper.
  3. Contact the primary trainer: .
  4. For Lesker 2: Please contact Graham Ewing for training after completing all of the Lesker training steps.

Operating Instructions