Flexible

The "Flexible" cleanliness group is part of the SNF/ExFab contamination policy.

The following is a list of equipment that fall into the "Flexible" category.

Equipment name & NEMO ID	Training Required & Charges	Cleanliness	Location	Notes
CytoViva HSI cytoviva	Cytoviva Training	Flexible	SNF Exfab Paul G Allen 151 Ocean
Voltera voltera	Voltera Training	Flexible	SNF Exfab Paul G Allen 151 Ocean
Asylum AFM afm-asylum	AFM Asylum Training	Flexible	SNF Exfab Paul G Allen 151 Ocean
Solidscape Wax 3D Printer 3d-wax-printer	Solidscape 3D Wax Printer Training	Flexible	SNF Exfab Paul G Allen 151 Ocean
DISCO Wafer Saw DISCO wafersaw	Wafersaw DISCO training	Flexible	SNF Exfab Paul G Allen 159 Capitola
DISCO Backgrinder disco-backgrind	Backgrinder DISCO Training	Flexible	SNF Exfab Paul G Allen 159 Capitola
Xplore Micro Compounder N/A	Micro Compounder training	Flexible	SNF Exfab Paul G Allen 159 Capitola
CMP GnP POLI-400L cmp	CMP POLI-400L Training	Flexible	SNF Exfab Paul G Allen 159 Capitola
Oriel Deep UV Exposure Lamp oriel-duv	Oriel DUV Training	Flexible	SNF Exfab Paul G Allen 155A Venice
AJA Evaporator aja-evap	Evaporator AJA training	Flexible	SNF Exfab Paul G Allen 155A Venice	For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance
Optomec Printer optomec-printer	Optomec Printer Training	Flexible	SNF Exfab Paul G Allen 155A Venice
Epilog Fusion M2 Laser Cutter lasercutter	Lasercutter Epilog Fusion M2 Training	Flexible	SNF Exfab Paul G Allen 155A Venice
Lesker Sputter lesker-sputter	Sputter Lesker 1&2 Training	Flexible	SNF Exfab Paul G Allen 155A Venice	reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter
First Nano carbon nanotube CVD furnace cvd-nanotube	cvd-nanotube training	Flexible	SNF Exfab Paul G Allen L119 Año Nuevo	Aligned single-walled carbon nanotube growth with ST-cut quartz substrates (available from SNF stockroom);1-15 single-walled carbon nanotubes per micron density
Hummer V Sputter Coater hummer	Hummer V Sputter Coater Training	Flexible	SNF Exfab Paul G Allen L119 Año Nuevo
Aixtron Black Magic graphene CVD furnace aixtron-graphene	CVD graphene furnace Aixtron Black Magic training	Flexible	SNF Exfab Paul G Allen L119 Año Nuevo
Aixtron MOCVD - III-V system aix200	MOCVD - III-V Aixtron training	Flexible	SNF MOCVD Paul G Allen 213XA	N and P doping available. For Si clean: SC1, SC2, HF dip. For III-V clean: HCl or HF dip.
Ika T18 Disperser disperser	IKA Disperser Training	Flexible	SNF Exfab Paul G Allen 155 Mavericks
Fujifilm Dimatix Ink Jet Printer nanoinkjet	Ink Jet Printer Dimatix Training	Flexible	SNF Exfab Paul G Allen 155 Mavericks
QSonica Q700 Sonicator sonicator	Probe Sonicator Training	Flexible	SNF Exfab Paul G Allen 155 Mavericks

Pages

Equipment name & NEMO ID	Technique	Cleanliness	Primary Materials Etched	Other Materials Etched	Material Thickness Range	Materials Lab Supplied	Process Temperature Range	Gases	Substrate Size	Substrate Type	Maximum Load
Oven (White) white-oven	Photolithography > Resist Bake > Oven Bake	Flexible					0 °C - 200 °C		Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (GaN) , (III-V) , (GaAs)
Oven BlueM 200°C to 430°C bluem	Photolithography > Resist Bake > Oven Bake	Flexible					0 °C - 430 °C		Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (GaN) , (III-V) , (GaAs) , (Various)
Oxford Dielectric Etcher oxford-rie	Etching > Dry Etching > Capacitively Coupled Plasma Etching (CCP) > Reactive Ion Etching (RIE)	Flexible	Si3N4 SiC SiO₂ PI	C				Ar CF₄ CHF₃ N₂ O₂ SF₆	4"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂)	1
Oxford III-V etcher Ox-35	Etching > Dry Etching > Inductively Coupled Plasma Etching (ICP)	Flexible	GaAs	AlGaN AlInP GaN InGaP InSb				Ar BCl₃ CH₄ Cl₂ H₂ HBr N₂ O₂ SF₆	4"		1
PDMS Hotplate hotplate-1	Other	Flexible
PDMS Spin Coater spincoat-g3p8	Patterning	Flexible
PDMS Workbench	Deposition	Flexible				dimethylpolysiloxane
PDS 2010 LABCOTER™ 2 Parylene Deposition System parcoater	Deposition	Flexible				poly(p-xylylene)			Pieces 2" 3" 4" 6" 8" Cones Disks Other	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (SiC) , (GaN) , (III-V) , (GaAs) , (Various) , (Various) , (LiNb) , (Various)
Plasma Therm Versaline LL ICP Deep Silicon Etcher PT-DSE	Etching > Dry Etching > Inductively Coupled Plasma Etching (ICP)	Flexible	Si					Ar C₄F₈ O₂ SF₆	4" 6"		1
Plasma Therm Versaline LL ICP Dielectric Etcher PT-Ox	Etching > Dry Etching > Inductively Coupled Plasma Etching (ICP)	Flexible	C Si3N4 SiC SiO₂	Various C-based				Ar C₄F₈ CF₄ CHF₃ H₂ He N₂ O₂	4" 6"		1
Plasma Therm Versaline LL ICP Metal Etcher PT-MTL	Etching > Dry Etching > Inductively Coupled Plasma Etching (ICP)	Flexible	Metals or metal compounds with volatile byproducts Al	GaN				Ar BCl₃ CF₄ CH₄ Cl₂ N₂ O₂ SF₆	4" 6"		1
Plasmaetch PE-50 plasma-etch	Etching > Dry Etching > Capacitively Coupled Plasma Etching (CCP) > Reactive Ion Etching (RIE)	Flexible	Resist					78% N₂, 21% O₂, ~1% Ar	Pieces 2" 3" 4" 6"		Multiple
Profilometer Alphastep 500 alphastep	Characterization > Surface Analysis > Profilometer > Step Profile	Flexible							Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (GaN) , (III-V) , (GaAs)	1
Profilometer AlphaStep D-300 alphastep2	Characterization > Surface Analysis > Profilometer > Step Profile	Flexible							Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (SiC) , (GaN) , (III-V) , (GaAs) , (Various) , (Various) , (LiNb)	1
QSonica Q700 Sonicator sonicator	Sonication	Flexible
RTA AllWin 610 aw610_r	Annealing & Oxidation > Rapid Thermal Annealing	Flexible					21 °C - 1150 °C	4% H₂ in N₂ Ar N₂ NH₃ O₂	Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2)
Samco PC300 Plasma Etch System samco	Cleaning > Resist Removal > Dry Resist Removal > Downstream/Remote Plasma Resist Removal Etching > Dry Etching > Capacitively Coupled Plasma Etching (CCP) > Plasma Mode Etching Etching > Dry Etching > Capacitively Coupled Plasma Etching (CCP) > Reactive Ion Etching (RIE)	Flexible	Resist	dimethylpolysiloxane Si Si3N4 SiO₂ SiON Various polymers PI			20 ºC	CF₄ O₂ SF₆	Pieces 2" 3" 4" 6" 8" Other	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (SiC) , (GaN) , (III-V) , (GaAs) , (Various) , (Various) , (LiNb) , (Various)	Four 4" wafers or two 6" wafers and one 8" wafer
Savannah ALD savannah	Deposition > Atomic Layer Deposition (ALD) > Thermal ALD	Flexible			1.00 Å - 50.00 nm	Metal oxides Ga₂O₃ SnO₂ Various Dielectrics ZnO₃ Alumina AZO Hafnia Titania Zirconia	24 °C - 250 °C	N₂	Pieces 2" 3" 4" 6" 8"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (SiC) , (GaN) , (III-V) , (Various) , (Various) , (LiNb) , (Various)
Sinton Lifetime Tester sinton-lifetime-tester	Characterization > Minority Carrier Characterization	Flexible							Pieces 2" 3" 4" 6"
Solidscape Wax 3D Printer 3d-wax-printer	3D Printing	Flexible