Flexible

The "Flexible" cleanliness group is part of the SNF/ExFab contamination policy.

The following is a list of equipment that fall into the "Flexible" category.

Equipment name & NEMO ID	Training Required & Charges	Cleanliness	Location	Notes
Fumehood 4 fumehood4	Fumehood 4 Training	Flexible	SNF Exfab Paul G Allen 155 Mavericks
Aixtron MOCVD - III-V system aix200	MOCVD - III-V Aixtron training	Flexible	SNF MOCVD Paul G Allen 213XA	N and P doping available. For Si clean: SC1, SC2, HF dip. For III-V clean: HCl or HF dip.
First Nano carbon nanotube CVD furnace cvd-nanotube	cvd-nanotube training	Flexible	SNF Exfab Paul G Allen L119 Año Nuevo	Aligned single-walled carbon nanotube growth with ST-cut quartz substrates (available from SNF stockroom);1-15 single-walled carbon nanotubes per micron density
Hummer V Sputter Coater hummer	Hummer V Sputter Coater Training	Flexible	SNF Exfab Paul G Allen L119 Año Nuevo
Aixtron Black Magic graphene CVD furnace aixtron-graphene	CVD graphene furnace Aixtron Black Magic training	Flexible	SNF Exfab Paul G Allen L119 Año Nuevo
Lesker Sputter lesker-sputter	Sputter Lesker 1&2 Training	Flexible	SNF Exfab Paul G Allen 155A Venice	reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter
Oriel Deep UV Exposure Lamp oriel-duv	Oriel DUV Training	Flexible	SNF Exfab Paul G Allen 155A Venice
AJA Evaporator aja-evap	Evaporator AJA training	Flexible	SNF Exfab Paul G Allen 155A Venice	For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance
Optomec Printer optomec-printer	Optomec Printer Training	Flexible	SNF Exfab Paul G Allen 155A Venice
Epilog Fusion M2 Laser Cutter lasercutter	Lasercutter Epilog Fusion M2 Training	Flexible	SNF Exfab Paul G Allen 155A Venice
DISCO Wafer Saw DISCO wafersaw	Wafersaw DISCO training	Flexible	SNF Exfab Paul G Allen 159 Capitola
DISCO Backgrinder disco-backgrind	Backgrinder DISCO Training	Flexible	SNF Exfab Paul G Allen 159 Capitola
Xplore Micro Compounder N/A	Micro Compounder training	Flexible	SNF Exfab Paul G Allen 159 Capitola
CMP GnP POLI-400L cmp	CMP POLI-400L Training	Flexible	SNF Exfab Paul G Allen 159 Capitola
Voltera voltera	Voltera Training	Flexible	SNF Exfab Paul G Allen 151 Ocean
Asylum AFM afm-asylum	AFM Asylum Training	Flexible	SNF Exfab Paul G Allen 151 Ocean
Solidscape Wax 3D Printer 3d-wax-printer	Solidscape 3D Wax Printer Training	Flexible	SNF Exfab Paul G Allen 151 Ocean
Alveole Primo alveole	Protein patterning Alveole Primo Training	Flexible	SNF Exfab Paul G Allen 151 Ocean
Jasco UV-Vis-NIR jasco-uv-vis-nir	Jasco UV-Vis-NIR Training	Flexible	SNF Exfab Paul G Allen 151 Ocean
Sinton Lifetime Tester sinton-lifetime-tester	Sinton Lifetime Tester Training	Flexible	SNF Exfab Paul G Allen 151 Ocean

Pages

Equipment name & NEMO ID	Technique	Cleanliness	Primary Materials Etched	Other Materials Etched	Material Thickness Range	Materials Lab Supplied	Materials User Supplied	Process Temperature Range	Gases	Accessories Available	Substrate Size	Substrate Type	Maximum Load
Formlabs Form2 3D Printer form2-3d-printer	3D Printing	Flexible											Multiple parts - depending on the final part size
Fujifilm Dimatix Ink Jet Printer nanoinkjet	Deposition > Ink	Flexible				PROM Approval Required for Materials
Fumehood 1 fumehood1	Controlled Environment	Flexible
Fumehood 2 fumehood2	Controlled Environment	Flexible
Fumehood 3 fumehood3	Controlled Environment	Flexible
Fumehood 4 fumehood4	Controlled Environment	Flexible
Glovebox-l glovebox-l	Controlled Environment	Flexible
Glovebox-r glovebox-r	Controlled Environment Material Transfer	Flexible				Various 2D Materials			N₂
Hummer V Sputter Coater hummer	Deposition > Physical Vapor Deposition (PVD) > Sputtering	Flexible
Ika T18 Disperser disperser	Sonication	Flexible
Jasco UV-Vis-NIR jasco-uv-vis-nir	Characterization	Flexible
Lesker Sputter lesker-sputter	Deposition > Physical Vapor Deposition (PVD) > Sputtering	Flexible				Ag Al AlSi Au Co Cr Cu Fe Nb Ni Pd Si SiO₂ Ta Ti TiN W Alumina ITO	CoFeB Ge Hf In₂O₃ LaB₆ Ru Sc Sn TiN WO₃ ZnO₃ ZrY GST Hafnia Moly Ti Tungsten				Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (SiC) , (GaN) , (III-V) , (GaAs)	1 4 inch wafer, 1 6 inch wafer
Malvern Dynamic Light Scattering (DLS) Zetasizer malvern-dls	Characterization > Dynamic Light Scattering	Flexible								Integrating Sphere	Pieces Other
Matrix Plasma Resist Strip matrix	Etching > Dry Etching > Downstream/Remote Plasma Etching Cleaning > Resist Removal > Dry Resist Removal > Downstream/Remote Plasma Resist Removal	Flexible	Resist	PI					O₂		4"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂)	25
Minitech-GX Micromill micromill	Machining > Micromilling	Flexible
MRC Reactive Ion Etcher mrc	Etching > Dry Etching > Capacitively Coupled Plasma Etching (CCP) > Reactive Ion Etching (RIE)	Flexible	Metals Various Dielectrics	Metal oxides PI					Ar CHClF₂ CHF₃ O₂ SF₆		Pieces 2" 3" 4" 6"		1
MVD mvd	Deposition > Atomic Layer Deposition (ALD) > Thermal ALD	Flexible			1.00 Å - 50.00 nm	C₉H₂₃NO₃Si Various Dielectrics Alumina DETA Hafnia ODS SAMS		24 °C - 150 °C	Ar		Pieces 2" 3" 4" 6" 8"
Nanoscribe Photonics GT nanoscribe	3D Printing Patterning	Flexible											1
Optomec Printer optomec-printer	Deposition > Ink	Flexible									Pieces 2" 3" 4" 6"
Oriel Deep UV Exposure Lamp oriel-duv	Other	Flexible