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Flexible

The "Flexible" cleanliness group is part of the SNF/ExFab contamination policy.

The following is a list of equipment that fall into the "Flexible" category.

Equipment name & Badger ID	Training Required & Charges	Cleanliness	Lab Organization	Location	Notes
First Nano carbon nanotube CVD furnace cvd-nanotube	cvd-nanotube training	Flexible	SNF	SNF Exfab Paul G Allen L119 Año Nuevo	Aligned single-walled carbon nanotube growth with ST-cut quartz substrates (available from SNF stockroom);1-15 single-walled carbon nanotubes per micron density
Fisher Accuspin 24C centrifuge	Centrifuge Training	Flexible	SNF	SNF Exfab Paul G Allen 155 Mavericks
Formlabs Form2 3D Printer form2-3d-printer	Form2 3D Printer Training	Flexible	SNF	SNF Exfab Paul G Allen 155 Mavericks
Fujifilm Dimatix Ink Jet Printer nanoinkjet	Dimatix Ink Jet Printer Training	Flexible	SNF	SNF Exfab Paul G Allen 155 Mavericks
Fumehood 1 fumehood1	Fumehood 1 Training	Flexible	SNF	SNF Exfab Paul G Allen 155 Mavericks
Fumehood 2 fumehood2	Fumehood 2 Training	Flexible	SNF	SNF Exfab Paul G Allen 155 Mavericks
Fumehood 3 fumehood3	Fumehood 3 Training	Flexible	SNF	SNF Exfab Paul G Allen 155 Mavericks
Fumehood 4 fumehood4	Fumehood 4 Training	Flexible	SNF	SNF Exfab Paul G Allen 155 Mavericks
Glovebox-l glovebox-l	Glovebox-l Training	Flexible	SNF	SNF Exfab Paul G Allen 155 Mavericks
Glovebox-r glovebox-r	Glovebox-r Training	Flexible	SNF	SNF Exfab Paul G Allen 155 Mavericks
GnP POLI-400L cmp	CMP Training	Flexible	SNF	SNF Exfab Paul G Allen 159 Capitola
Hummer V Sputter Coater hummer	Hummer V Sputter Coater Training	Flexible	SNF	SNF Exfab Paul G Allen L119 Año Nuevo
Ika T18 Disperser disperser	IKA Disperser Training	Flexible	SNF	SNF Exfab Paul G Allen 155 Mavericks
Innotec Evaporator Innotec	Innotec Evaporator Training	Flexible	SNF	SNF Cleanroom Paul G Allen L107	Precious metals limit is <200nm
Jasco UV-Vis-NIR jasco-uv-vis-nir	Jasco UV-Vis-NIR Training	Flexible	SNF	SNF Exfab Paul G Allen 151 Ocean
Lesker Sputter lesker-sputter	Lesker Sputter Training	Flexible	SNF Exfab	SNF Exfab Paul G Allen 155A Venice	reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter
Lithography Solvent Bench lithosolv	Lithography Solvent Bench Training	Flexible	SNF	SNF Cleanroom Paul G Allen L107	Manual solvent cleaning of substrates or masks. Teflon coated metal tweezers cleaning.
Malvern Dynamic Light Scattering (DLS) Zetasizer malvern-dls	Malvern Dynamic Light Scattering (DLS) Zetasizer Training	Flexible	SNF Exfab	SNF Exfab Paul G Allen 155 Mavericks
Matrix Plasma Resist Strip matrix	Matrix Plasma Resist Strip Training	Flexible	SNF	SNF Cleanroom Paul G Allen L107	Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Chuck temperature controls wafer heating.
Micro Mist Coater PDR-04 micromist-coater	Micromist Coater Training	Flexible	SNF	SNF Exfab Paul G Allen 104 Stinson

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Equipment name & Badger ID	Technique	Cleanliness	Primary Materials Etched	Other Materials Etched	Material Thickness Range	Materials Lab Supplied	Materials User Supplied	Minimum Resolution	Objective Separation	Process Temperature Range	Chemicals	Gases	Accessories Available	Substrate Size	Substrate Type	Maximum Load
First Nano carbon nanotube CVD furnace cvd-nanotube	Deposition > Chemical Vapor Deposition (CVD) > Carbon Nanotube CVD Growth	Flexible				CNT				800 °C - 1100 °C		Ar C₂H₅OH CH₄ H₂ O₂		Pieces 2" 3" 4"	(Si) , (SiO2)	1x4" wafer or multiple pieces
Fisher Accuspin 24C centrifuge	Centrifugation	Flexible
Formlabs Form2 3D Printer form2-3d-printer	3D Printing	Flexible														Multiple parts - depending on the final part size
Fujifilm Dimatix Ink Jet Printer nanoinkjet	Deposition > Ink	Flexible				PROM Approval Required for Materials
Fumehood 1 fumehood1	Controlled Environment	Flexible
Fumehood 2 fumehood2	Controlled Environment	Flexible
Fumehood 3 fumehood3	Controlled Environment	Flexible
Fumehood 4 fumehood4	Controlled Environment	Flexible
Glovebox-l glovebox-l	Controlled Environment	Flexible
Glovebox-r glovebox-r	Controlled Environment Material Transfer	Flexible				Various 2D Materials						N₂
GnP POLI-400L cmp	Machining > Wafer Polishing	Flexible
Hummer V Sputter Coater hummer	Deposition > Physical Vapor Deposition (PVD) > Sputtering	Flexible
Ika T18 Disperser disperser	Sonication	Flexible
Innotec Evaporator Innotec	Deposition > Physical Vapor Deposition (PVD) > Evaporation	Flexible				Ag Al Au Co Cr Cu Fe Ge In Ni Pd Si Ta Ti W Moly	Er Hf Ir Ru Tb Y							Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2)	22 four inch wafers
Jasco UV-Vis-NIR jasco-uv-vis-nir	Characterization	Flexible
Lesker Sputter lesker-sputter	Deposition > Physical Vapor Deposition (PVD) > Sputtering	Flexible				Ag Al AlSi Au Co Cr Cu Fe Nb Ni Pd Si SiO₂ Ta Ti TiN W Alumina ITO	CoFeB Ge Hf In₂O₃ LaB₆ Ru Sc Sn TiN WO₃ ZnO₃ ZrY GST Hafnia Moly Ti Tungsten							Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (SiC) , (GaN) , (III-V) , (GaAs)	1 4 inch wafer, 1 6 inch wafer
Lithography Solvent Bench lithosolv	Cleaning > Solvent Cleaning	Flexible									Solvents			Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (GaN) , (III-V) , (GaAs)
Malvern Dynamic Light Scattering (DLS) Zetasizer malvern-dls	Characterization > Dynamic Light Scattering	Flexible											Integrating Sphere	Pieces Other
Matrix Plasma Resist Strip matrix	Etching > Dry Etching > Downstream/Remote Plasma Etching Cleaning > Resist Removal > Dry Resist Removal > Downstream/Remote Plasma Resist Removal	Flexible	Resist	PI								O₂		4"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂)	25
Micro Mist Coater PDR-04 micromist-coater	Optical Photolithography > Resist coat > Resist Spray Coat (manual)	Flexible

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