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Flexible

The "Flexible" cleanliness group is part of the SNF/ExFab contamination policy.

The following is a list of equipment that fall into the "Flexible" category.

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Equipment name & Badger ID Training Required & Charges Cleanliness Location Notes
Fujifilm Dimatix Ink Jet Printer
nanoinkjet
Dimatix Ink Jet Printer Training Flexible SNF Exfab Paul G Allen 155 Mavericks
Fumehood 1
fumehood1
Fumehood 1 Training Flexible SNF Exfab Paul G Allen 155 Mavericks
Fumehood 2
fumehood2
Fumehood 2 Training Flexible SNF Exfab Paul G Allen 155 Mavericks
Fumehood 3
fumehood3
Fumehood 3 Training Flexible SNF Exfab Paul G Allen 155 Mavericks
Fumehood 4
fumehood4
Fumehood 4 Training Flexible SNF Exfab Paul G Allen 155 Mavericks
Glovebox-l
glovebox-l
Glovebox-l Training Flexible SNF Exfab Paul G Allen 155 Mavericks
Glovebox-r
glovebox-r
Glovebox-r Training Flexible SNF Exfab Paul G Allen 155 Mavericks
Hummer V Sputter Coater
hummer
Hummer V Sputter Coater Training Flexible SNF Exfab Paul G Allen L119 Año Nuevo
Ika T18 Disperser
disperser
IKA Disperser Training Flexible SNF Exfab Paul G Allen 155 Mavericks
Innotec Evaporator
Innotec
Innotec Evaporator Training Flexible SNF Cleanroom Paul G Allen L107

Precious metals limit is <200nm

Jasco UV-Vis-NIR
jasco-uv-vis-nir
Jasco UV-Vis-NIR Training Flexible SNF Exfab Paul G Allen 151 Ocean
Lesker Sputter
lesker-sputter
Lesker 1&2 Sputter Training Flexible SNF Exfab Paul G Allen 155A Venice

reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter

Lithography Solvent Bench
lithosolv
Lithography Solvent Bench Training Flexible SNF Cleanroom Paul G Allen L107

Manual solvent cleaning of substrates or masks. Teflon coated metal tweezers cleaning.

Malvern Dynamic Light Scattering (DLS) Zetasizer
malvern-dls
Malvern Dynamic Light Scattering (DLS) Zetasizer Training Flexible SNF Exfab Paul G Allen 155 Mavericks
Matrix Plasma Resist Strip
matrix
Matrix Plasma Resist Strip Training Flexible SNF Cleanroom Paul G Allen L107

Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Chuck temperature controls wafer heating.

Minitech-GX Micromill
micromill
Micromill Training Flexible SNF Exfab Paul G Allen 155 Mavericks
MRC Reactive Ion Etcher
mrc
MRC Reactive Ion Etcher Training Flexible SNF Cleanroom Paul G Allen L107

Typically used for sputter etching; Single wafer, direct load system; wafers/ pieces can be directly placed on electrode

MVD
mvd
MVD Training Flexible SNF Cleanroom Paul G Allen L107

Reactor located inside glovebox

Nanoscribe Photonics GT
nanoscribe
Nanoscribe Photonics GT Training Flexible SNF Exfab Paul G Allen 104 Stinson
Optomec Printer
optomec-printer
Optomec Printer Training Flexible SNF Exfab Paul G Allen 155A Venice

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Equipment name & Badger ID Technique Cleanliness Primary Materials Etched Other Materials Etched Material Thickness Range Materials Lab Supplied Materials User Supplied Process Temperature Range Chemicals Gases Accessories Available Substrate Size Substrate Type Maximum Load
Fujifilm Dimatix Ink Jet Printer
nanoinkjet
Flexible
Fumehood 1
fumehood1
Flexible
Fumehood 2
fumehood2
Flexible
Fumehood 3
fumehood3
Flexible
Fumehood 4
fumehood4
Flexible
Glovebox-l
glovebox-l
Flexible
Glovebox-r
glovebox-r
Flexible
Hummer V Sputter Coater
hummer
Flexible
Ika T18 Disperser
disperser
Flexible
Innotec Evaporator
Innotec
Flexible ,
,
22 four inch wafers
Jasco UV-Vis-NIR
jasco-uv-vis-nir
Flexible
Lesker Sputter
lesker-sputter
Flexible ,
,
,
,
,
,
,
,
,
1 4 inch wafer, 1 6 inch wafer
Lithography Solvent Bench
lithosolv
Flexible ,
,
,
,
,
,
,
,
Malvern Dynamic Light Scattering (DLS) Zetasizer
malvern-dls
Flexible

Integrating Sphere

Matrix Plasma Resist Strip
matrix
Flexible
,
,
,
,
25
Minitech-GX Micromill
micromill
Flexible
MRC Reactive Ion Etcher
mrc
Flexible 1
MVD
mvd
Flexible
1.00 Å - 50.00 nm
24 °C - 150 °C
Nanoscribe Photonics GT
nanoscribe
Flexible 1
Optomec Printer
optomec-printer
Flexible

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