The "Flexible" cleanliness group is part of the SNF/ExFab contamination policy.
The following is a list of equipment that fall into the "Flexible" category.
Equipment name & Badger ID | Technique | Cleanliness | Primary Materials Etched | Other Materials Etched | Material Thickness Range | Materials Lab Supplied | Materials User Supplied | Process Temperature Range | Chemicals | Gases | Accessories Available | Substrate Size | Substrate Type | Maximum Load |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Fujifilm Dimatix Ink Jet Printer nanoinkjet |
Flexible | |||||||||||||
Fumehood 1 fumehood1 |
Flexible | |||||||||||||
Fumehood 2 fumehood2 |
Flexible | |||||||||||||
Fumehood 3 fumehood3 |
Flexible | |||||||||||||
Fumehood 4 fumehood4 |
Flexible | |||||||||||||
Glovebox-l glovebox-l |
Flexible | |||||||||||||
Glovebox-r glovebox-r |
Flexible | |||||||||||||
Hummer V Sputter Coater hummer |
Flexible | |||||||||||||
Ika T18 Disperser disperser |
Flexible | |||||||||||||
Innotec Evaporator Innotec |
Flexible |
, , |
22 four inch wafers | |||||||||||
Jasco UV-Vis-NIR jasco-uv-vis-nir |
Flexible | |||||||||||||
Lesker Sputter lesker-sputter |
Flexible |
, , , , , , , , , |
1 4 inch wafer, 1 6 inch wafer | |||||||||||
Lithography Solvent Bench lithosolv |
Flexible |
, , , , , , , , |
||||||||||||
Malvern Dynamic Light Scattering (DLS) Zetasizer malvern-dls |
Flexible |
Integrating Sphere |
||||||||||||
Matrix Plasma Resist Strip matrix |
Flexible |
, , , , |
25 | |||||||||||
Minitech-GX Micromill micromill |
Flexible | |||||||||||||
MRC Reactive Ion Etcher mrc |
Flexible | 1 | ||||||||||||
MVD mvd |
Flexible |
1.00 Å -
50.00 nm
|
24 °C - 150 °C
|
|||||||||||
Nanoscribe Photonics GT nanoscribe |
Flexible | 1 | ||||||||||||
Optomec Printer optomec-printer |
Flexible |