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Flexible

The "Flexible" cleanliness group is part of the SNF/ExFab contamination policy.

The following is a list of equipment that fall into the "Flexible" category.

Equipment name & Badger ID	Training Required & Charges	Cleanliness	Location	Notes
Fujifilm Dimatix Ink Jet Printer nanoinkjet	Dimatix Ink Jet Printer Training	Flexible	SNF Exfab Paul G Allen 155 Mavericks
Fumehood 1 fumehood1	Fumehood 1 Training	Flexible	SNF Exfab Paul G Allen 155 Mavericks
Fumehood 2 fumehood2	Fumehood 2 Training	Flexible	SNF Exfab Paul G Allen 155 Mavericks
Fumehood 3 fumehood3	Fumehood 3 Training	Flexible	SNF Exfab Paul G Allen 155 Mavericks
Fumehood 4 fumehood4	Fumehood 4 Training	Flexible	SNF Exfab Paul G Allen 155 Mavericks
Glovebox-l glovebox-l	Glovebox-l Training	Flexible	SNF Exfab Paul G Allen 155 Mavericks
Glovebox-r glovebox-r	Glovebox-r Training	Flexible	SNF Exfab Paul G Allen 155 Mavericks
Hummer V Sputter Coater hummer	Hummer V Sputter Coater Training	Flexible	SNF Exfab Paul G Allen L119 Año Nuevo
Ika T18 Disperser disperser	IKA Disperser Training	Flexible	SNF Exfab Paul G Allen 155 Mavericks
Innotec Evaporator Innotec	Innotec Evaporator Training	Flexible	SNF Cleanroom Paul G Allen L107	Precious metals limit is <200nm
Jasco UV-Vis-NIR jasco-uv-vis-nir	Jasco UV-Vis-NIR Training	Flexible	SNF Exfab Paul G Allen 151 Ocean
Lesker Sputter lesker-sputter	Lesker 1&2 Sputter Training	Flexible	SNF Exfab Paul G Allen 155A Venice	reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter
Lithography Solvent Bench lithosolv	Lithography Solvent Bench Training	Flexible	SNF Cleanroom Paul G Allen L107	Manual solvent cleaning of substrates or masks. Teflon coated metal tweezers cleaning.
Malvern Dynamic Light Scattering (DLS) Zetasizer malvern-dls	Malvern Dynamic Light Scattering (DLS) Zetasizer Training	Flexible	SNF Exfab Paul G Allen 155 Mavericks
Matrix Plasma Resist Strip matrix	Matrix Plasma Resist Strip Training	Flexible	SNF Cleanroom Paul G Allen L107	Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Chuck temperature controls wafer heating.
Minitech-GX Micromill micromill	Micromill Training	Flexible	SNF Exfab Paul G Allen 155 Mavericks
MRC Reactive Ion Etcher mrc	MRC Reactive Ion Etcher Training	Flexible	SNF Cleanroom Paul G Allen L107	Typically used for sputter etching; Single wafer, direct load system; wafers/ pieces can be directly placed on electrode
MVD mvd	MVD Training	Flexible	SNF Cleanroom Paul G Allen L107	Reactor located inside glovebox
Nanoscribe Photonics GT nanoscribe	Nanoscribe Photonics GT Training	Flexible	SNF Exfab Paul G Allen 104 Stinson
Optomec Printer optomec-printer	Optomec Printer Training	Flexible	SNF Exfab Paul G Allen 155A Venice

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Equipment name & Badger ID	Technique	Cleanliness	Primary Materials Etched	Other Materials Etched	Material Thickness Range	Materials Lab Supplied	Materials User Supplied	Process Temperature Range	Chemicals	Gases	Accessories Available	Substrate Size	Substrate Type	Maximum Load
Fujifilm Dimatix Ink Jet Printer nanoinkjet	Deposition > Ink	Flexible				PROM Approval Required for Materials
Fumehood 1 fumehood1	Controlled Environment	Flexible
Fumehood 2 fumehood2	Controlled Environment	Flexible
Fumehood 3 fumehood3	Controlled Environment	Flexible
Fumehood 4 fumehood4	Controlled Environment	Flexible
Glovebox-l glovebox-l	Controlled Environment	Flexible
Glovebox-r glovebox-r	Controlled Environment Material Transfer	Flexible				Various 2D Materials				N₂
Hummer V Sputter Coater hummer	Deposition > Physical Vapor Deposition (PVD) > Sputtering	Flexible
Ika T18 Disperser disperser	Sonication	Flexible
Innotec Evaporator Innotec	Deposition > Physical Vapor Deposition (PVD) > Evaporation	Flexible				Ag Al Au Co Cr Cu Fe Ge In Ni Pd Si Ta Ti W Moly	Er Hf Ir Ru Tb Y					Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2)	22 four inch wafers
Jasco UV-Vis-NIR jasco-uv-vis-nir	Characterization	Flexible
Lesker Sputter lesker-sputter	Deposition > Physical Vapor Deposition (PVD) > Sputtering	Flexible				Ag Al AlSi Au Co Cr Cu Fe Nb Ni Pd Si SiO₂ Ta Ti TiN W Alumina ITO	CoFeB Ge Hf In₂O₃ LaB₆ Ru Sc Sn TiN WO₃ ZnO₃ ZrY GST Hafnia Moly Ti Tungsten					Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (SiC) , (GaN) , (III-V) , (GaAs)	1 4 inch wafer, 1 6 inch wafer
Lithography Solvent Bench lithosolv	Cleaning > Solvent Cleaning	Flexible							Solvents			Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (GaN) , (III-V) , (GaAs)
Malvern Dynamic Light Scattering (DLS) Zetasizer malvern-dls	Characterization > Dynamic Light Scattering	Flexible									Integrating Sphere	Pieces Other
Matrix Plasma Resist Strip matrix	Etching > Dry Etching > Downstream/Remote Plasma Etching Cleaning > Resist Removal > Dry Resist Removal > Downstream/Remote Plasma Resist Removal	Flexible	Resist	PI						O₂		4"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂)	25
Minitech-GX Micromill micromill	Machining > Micromilling	Flexible
MRC Reactive Ion Etcher mrc	Etching > Dry Etching > Capacitively Coupled Plasma Etching (CCP) > Reactive Ion Etching (RIE)	Flexible	Metals Various Dielectrics	Metal oxides PI						Ar CHClF₂ CHF₃ O₂ SF₆		Pieces 2" 3" 4" 6"		1
MVD mvd	Deposition > Atomic Layer Deposition (ALD) > Thermal ALD	Flexible			1.00 Å - 50.00 nm	C₉H₂₃NO₃Si Various Dielectrics Alumina DETA Hafnia ODS SAMS		24 °C - 150 °C		Ar		Pieces 2" 3" 4" 6" 8"
Nanoscribe Photonics GT nanoscribe	3D Printing Patterning	Flexible												1
Optomec Printer optomec-printer	Deposition > Ink	Flexible										Pieces 2" 3" 4" 6"

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