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Wafer Polishing

Wafer polishing is used to planarize patterned surfaces and to smooth surface roughness.
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Equipment name & Badger ID Location Image Overview Link to Training
SNF Exfab Paul G Allen 159 Capitola

The POLI-400L CMP (Chemical Mechanical Polishing) system is designed to polish standard 4” wafers (no pieces). CMP is often used to polish wafers, to planarize patterned surfaces, and to smooth surface roughness.

CMP Training