Photolithography is the process used to transfer patterns of geometric shapes to a flat substrate. The substrates are first coated with a material called resist, then light (called optical photolithography) is used to catalyze reactions in the resist to create the shape of the pattern. The resist is then developed to separate the un-reacted and reacted portions, leaving a pattern on the substrate. The patterned resist can be used to pattern your material of choice with additional processes like etching or liftoff.
The SNF has various types of equipment that use light to create patterns in the resist. There are other methods which use electron beams (called e-beam lithography) instead and those processes can be done in the SNSF.
The subcategories list the equipment that perform the different steps of the lithography process.
Equipment name & Badger ID | Location | Image | Overview | Link to Training |
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110°C Oven oven110 |
SNF Cleanroom Paul G Allen L107 |
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The 110°C Oven bakes the wafers with resist at 110ºC after the development, called post-bake.Read more |
110°C Oven Training |
90°C Oven oven90 |
SNF Cleanroom Paul G Allen L107 |
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The 90°C Oven is the 90°C prebake oven. It is used to bake wafers after resist coating.Read more |
90°C Oven Training |
ASML PAS 5500/60 i-line Stepper asml |
SNF Cleanroom Paul G Allen L107 |
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The ASML PAS 5500/60 stepper is an i-line system with automatic 100mm* wafer cassette processing capability. Using 365nm near-UV light this stepper is capable of a minimum feature size of...Read more |
ASML PAS 5500/60 i-line Stepper Training |
Blue M Oven bluem |
SNF Cleanroom Paul G Allen L107 |
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The BlueM oven is for 200°C to 437°C temperature bakes, i.e. polyimide.Read more |
Blue M Oven Training |
EV Group Contact Aligner evalign |
SNF Cleanroom Paul G Allen L107 |
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The EV Contact Aligner system is part of the Electronic Visions 620 aligner- 501 bonder system. This tool can perform mask-to-wafer alignment for exposure or wafer-to-wafer alignment for bonding. Our...Read more |
EV Group Contact Aligner Training |
EVG 101 Spray Coater evgspraycoat |
SNF Cleanroom Paul G Allen L107 | EVG 101 Spray Coater Training | ||
Ex Fab Develop Wet Bench wbexfab_dev |
SNF Exfab Paul G Allen 104 Stinson |
The wbexfab_dev wet bench is primarily used for developing of photoresist. No solvents may be used here. Please use solvent wet bench for SU8 development. The bench is equipped with...Read more |
WbExfab_Dev Training | |
Headway 3 Manual Resist Spinner headway3 |
SNF Exfab Paul G Allen 104 Stinson |
The Headway Coater is used to manually apply photoresist to any substrate. Centrifugal force uniformly spreads fluid across the surface of the spinning substrate. The spin speed, spin time substrate...Read more |
Headway 3 Training | |
Headway Manual Resist Spinner headway2 |
SNF Cleanroom Paul G Allen L107 |
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The Headway Coater is used to apply photoresist to any substrate. Centrifugal force uniformly spreads fluid across the surface of the spinning substrate. The spin speed, spin time, and substrate...Read more |
Headway Manual Resist Spinner Training |
Heidelberg MLA 150 heidelberg |
SNF Exfab Paul G Allen 104 Stinson |
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The MLA150 is a high speed direct write lithography tool extended by capabilities formerly only available on Mask Aligners. It can expose the patterns directly without prior fabrication of a...Read more |
Heidelberg Training |
Heidelberg MLA 150 - 2 heidelberg2 |
SNF Cleanroom Paul G Allen L107 |
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The MLA150 is a high speed direct write lithography tool extended by capabilities formerly only available on Mask Aligners. It can expose the patterns directly without prior fabrication of a...Read more |
Heidelberg Training |
HMDS Vapor Prime Oven, YES yes |
SNF Cleanroom Paul G Allen L107 |
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The YES prime oven dehydrates the wafers at 150ºC and primes the wafers using HMDS (Hexamethyldisilazane) allowing better coverage and adhesion between oxides and resists.Read more |
YES Prime Oven Training |
HMDS Vapor Prime Oven, YES2 yes2 |
SNF Exfab Paul G Allen 104 Stinson | Exfab YES2 HMDS oven training | ||
Karl Suss MA-6 Contact Aligner 1 karlsuss |
SNF Cleanroom Paul G Allen L107 |
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The Karl Suss MA-6 Contact Aligner system can perform precision mask-to-wafer front- or back-side alignment and near-UV photoresist exposure in hard- and soft- contact, as well as high and low...Read more |
Karl Suss MA-6 Contact Aligner 1 and 2 Training |
Karl Suss MA-6 Contact Aligner 2 karlsuss2 |
SNF Cleanroom Paul G Allen L107 |
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The Karl Suss MA-6 Contact Aligner system can perform precision mask-to-wafer front- or back-side alignment and near-UV photoresist exposure in hard- and soft- contact, as well as high and low...Read more |
Karl Suss MA-6 Contact Aligner 1 and 2 Training |
Laurell Manual Resist Spinner laurell-R |
SNF Cleanroom Paul G Allen L107 | Laurell Manual Resist Spinner Training | ||
Mask Scrubber masksrub |
SNF Cleanroom Paul G Allen L107 | Manual mask cleaner for 5 inch masks, water under pressure. Read more | Mask Scrubber Training | |
SVG Develop Track 1 svgdev |
SNF Cleanroom Paul G Allen L107 |
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The SVG (Silicon Valley Group) developer is an automated system with two independent tracks (svgdev and svgdev2) for developing and post-baking exposed photoresist-coated 4" wafers. Each track system includes two...Read more |
SVG Resist Develop tracks 1 and 2 Training |
SVG Develop Track 2 svgdev2 |
SNF Cleanroom Paul G Allen L107 |
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The SVG (Silicon Valley Group) developer is an automated system with two independent tracks (svgdev and svgdev2) for developing and post-baking exposed photoresist-coated 4" wafers. Each track system includes two...Read more |
SVG Resist Develop tracks 1 and 2 Training |
SVG Resist Coat Track 1 svgcoat |
SNF Cleanroom Paul G Allen L107 |
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The SVG (Silicon Valley Group) coater is an automated track system for dispensing photoresist on 4" silicon, glass, or quartz wafers. The system includes two stations: a prime oven which...Read more |
SVG Resist Coat Tracks 1 and 2 Training |