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Optical Photolithography

Photolithography is the process used to transfer patterns of geometric shapes to a flat substrate. The substrates are first coated with a material called resist, then light (called optical photolithography) is used to catalyze reactions in the resist to create the shape of the pattern. The resist is then developed to separate the un-reacted and reacted portions, leaving a pattern on the substrate. The patterned resist can be used to pattern your material of choice with additional processes like etching or liftoff. 

The SNF has various types of equipment that use light to create patterns in the resist. There are other methods which use electron beams (called e-beam lithography) instead and those processes can be done in the SNSF. 

The subcategories list the equipment that perform the different steps of the lithography process.

  • ​Exposure lists the tools that will use light to create a reaction in the resist. Different tools use different light wavelengths and have different resolution capabilities.
  • Mask cleaning (Manual) is the equipment used to clean masks for use in exposure equipment which requires a physical mask.
  • Resist bake lists the equipment that heats the resist after it is applied.
  • Resist coat lists the equipment that is used to put resist on a sample.
  • Resist develop lists the equipment that uses solvents to separate the non-reacted and reacted resist after exposure.
  • Wafer preparation before resist lists the equipment that is used to treat your sample surface before the resist coat to help ensure adhesion and uniform coating.

 

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Equipment name & Badger ID Location Image Overview Link to Training
110°C Oven
oven110
SNF Cleanroom Paul G Allen L107

The 110°C Oven bakes the wafers with resist at 110ºC after the development, called post-bake.Read more

110°C Oven Training
90°C Oven
oven90
SNF Cleanroom Paul G Allen L107

The 90°C Oven is the 90°C prebake oven. It is used to bake wafers after resist coating.Read more

90°C Oven Training
ASML PAS 5500/60 i-line Stepper
asml
SNF Cleanroom Paul G Allen L107

The ASML PAS 5500/60 stepper is an i-line system with automatic 100mm* wafer cassette processing capability. Using 365nm near-UV light this stepper is capable of a minimum feature size of...Read more

ASML PAS 5500/60 i-line Stepper Training
Blue M Oven
bluem
SNF Cleanroom Paul G Allen L107

The BlueM oven is for 200°C to 437°C temperature bakes, i.e. polyimide.Read more

Blue M Oven Training
Ebeam Process Wet Bench
wbebres
SNF Cleanroom Paul G Allen L107 Ebeam Process Wet Bench Training
EV Group Contact Aligner
evalign
SNF Cleanroom Paul G Allen L107

The EV Contact Aligner system is part of the Electronic Visions 620 aligner- 501 bonder system. This tool can perform mask-to-wafer alignment for exposure or wafer-to-wafer alignment for bonding. Our...Read more

EV Group Contact Aligner Training
EVG 101 Spray Coater
evgspraycoat
SNF Cleanroom Paul G Allen L107 EVG 101 Spray Coater Training
Ex Fab Develop Wet Bench
wbexfab_dev
SNF Exfab Paul G Allen 104 Stinson

The wbexfab_dev wet bench is primarily used for developing of photoresist. No solvents may be used here. Please use solvent wet bench for SU8 development. The bench is equipped with...Read more

WbExfab_Dev Training
Headway 3 Manual Resist Spinner
headway3
SNF Exfab Paul G Allen 104 Stinson

The Headway Coater is used to manually apply photoresist to any substrate. Centrifugal force uniformly spreads fluid across the surface of the spinning substrate. The spin speed, spin time substrate...Read more

Headway 3 Training
Headway Manual Resist Spinner
headway2
SNF Cleanroom Paul G Allen L107
Headway2 manaul resist coater

The Headway Coater is used to apply photoresist to any substrate. Centrifugal force uniformly spreads fluid across the surface of the spinning substrate. The spin speed, spin time, and substrate...Read more

Headway Manual Resist Spinner Training
Heidelberg MLA 150
heidelberg
SNF Exfab Paul G Allen 104 Stinson
[Photo: image of user at Heidelberg]

The MLA150 is a high speed direct write lithography tool extended by capabilities formerly only available on Mask Aligners. It can expose the patterns directly without prior fabrication of a...Read more

Heidelberg Training
Heidelberg MLA 150 - 2
heidelberg2
SNF Cleanroom Paul G Allen L107

The MLA150 is a high speed direct write lithography tool extended by capabilities formerly only available on Mask Aligners. It can expose the patterns directly without prior fabrication of a...Read more

Heidelberg Training
HMDS Vapor Prime Oven, YES
yes
SNF Cleanroom Paul G Allen L107

The YES prime oven dehydrates the wafers at 150ºC and primes the wafers using HMDS (Hexamethyldisilazane) allowing better coverage and adhesion between oxides and resists.Read more

YES Prime Oven Training
HMDS Vapor Prime Oven, YES2
yes2
SNF Exfab Paul G Allen 104 Stinson Exfab YES2 HMDS oven training
Karl Suss MA-6 Contact Aligner 1
karlsuss
SNF Cleanroom Paul G Allen L107
Karlsuss1

The Karl Suss MA-6 Contact Aligner system can perform precision mask-to-wafer front- or back-side alignment and near-UV photoresist exposure in hard- and soft- contact, as well as high and low...Read more

Karl Suss MA-6 Contact Aligner 1 and 2 Training
Karl Suss MA-6 Contact Aligner 2
karlsuss2
SNF Cleanroom Paul G Allen L107
Karlsuss2

The Karl Suss MA-6 Contact Aligner system can perform precision mask-to-wafer front- or back-side alignment and near-UV photoresist exposure in hard- and soft- contact, as well as high and low...Read more

Karl Suss MA-6 Contact Aligner 1 and 2 Training
Laurell Manual Resist Spinner
laurell-R
SNF Cleanroom Paul G Allen L107 Laurell Manual Resist Spinner Training
Mask Scrubber
masksrub
SNF Cleanroom Paul G Allen L107 Manual mask cleaner for 5 inch masks, water under pressure. Read more Mask Scrubber Training
Micro Mist Coater PDR-04
micromist-coater
SNF Exfab Paul G Allen 104 Stinson

The Micro Mist coater is a research grade mini electrospray tool. It can be used to blanket coat material onto a substrate with minimal wastage of the material. It can...Read more

Micromist Coater Training
SVG Develop Track 1
svgdev
SNF Cleanroom Paul G Allen L107
SVGdev1 back track

The SVG (Silicon Valley Group) developer is an automated system with two independent tracks (svgdev and svgdev2) for developing and post-baking exposed photoresist-coated 4" wafers. Each track system includes two...Read more

SVG Resist Develop tracks 1 and 2 Training

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