Optical Photolithography

Photolithography is the process used to transfer patterns of geometric shapes to a flat substrate. The substrates are first coated with a material called resist, then light (called optical photolithography) is used to catalyze reactions in the resist to create the shape of the pattern. The resist is then developed to separate the un-reacted and reacted portions, leaving a pattern on the substrate. The patterned resist can be used to pattern your material of choice with additional processes like etching or liftoff.

The SNF has various types of equipment that use light to create patterns in the resist. There are other methods which use electron beams (called e-beam lithography) instead and those processes can be done in the SNSF.

The subcategories list the equipment that perform the different steps of the lithography process.

Exposure lists the tools that will use light to create a reaction in the resist. Different tools use different light wavelengths and have different resolution capabilities.
Mask cleaning (Manual) is the equipment used to clean masks for use in exposure equipment which requires a physical mask.
Resist bake lists the equipment that heats the resist after it is applied.
Resist coat lists the equipment that is used to put resist on a sample.
Resist develop lists the equipment that uses solvents to separate the non-reacted and reacted resist after exposure.
Wafer preparation before resist lists the equipment that is used to treat your sample surface before the resist coat to help ensure adhesion and uniform coating.

Equipment name & Badger ID	Location	Overview	Link to Training
110°C Oven oven110	SNF Cleanroom Paul G Allen L107	The 110°C Oven bakes the wafers with resist at 110ºC after the development, called post-bake.Read more	110°C Oven Training
90°C Oven oven90	SNF Cleanroom Paul G Allen L107	The 90°C Oven is the 90°C prebake oven. It is used to bake wafers after resist coating.Read more	90°C Oven Training
ASML PAS 5500/60 i-line Stepper asml	SNF Cleanroom Paul G Allen L107	The ASML PAS 5500/60 stepper is an i-line system with automatic 100mm^* wafer cassette processing capability. Using 365nm near-UV light this stepper is capable of a minimum feature size of...Read more	ASML PAS 5500/60 i-line Stepper Training
Blue M Oven bluem	SNF Cleanroom Paul G Allen L107	The BlueM oven is for 200°C to 437°C temperature bakes, i.e. polyimide.Read more	Blue M Oven Training
Ebeam Process Wet Bench wbebres	SNF Cleanroom Paul G Allen L107		Ebeam Process Wet Bench Training
EV Group Contact Aligner evalign	SNF Cleanroom Paul G Allen L107	The EV Contact Aligner system is part of the Electronic Visions 620 aligner- 501 bonder system. This tool can perform mask-to-wafer alignment for exposure or wafer-to-wafer alignment for bonding. Our...Read more	EV Group Contact Aligner Training
EVG 101 Spray Coater evgspraycoat	SNF Cleanroom Paul G Allen L107		EVG 101 Spray Coater Training
Ex Fab Develop Wet Bench wbexfab_dev	SNF Exfab Paul G Allen 104 Stinson	The wbexfab_dev wet bench is primarily used for developing of photoresist. No solvents may be used here. Please use solvent wet bench for SU8 development. The bench is equipped with...Read more	WbExfab_Dev Training
Headway 3 Manual Resist Spinner headway3	SNF Exfab Paul G Allen 104 Stinson	The Headway Coater is used to manually apply photoresist to any substrate. Centrifugal force uniformly spreads fluid across the surface of the spinning substrate. The spin speed, spin time substrate...Read more	Headway 3 Training
Headway Manual Resist Spinner headway2	SNF Cleanroom Paul G Allen L107	The Headway Coater is used to apply photoresist to any substrate. Centrifugal force uniformly spreads fluid across the surface of the spinning substrate. The spin speed, spin time, and substrate...Read more	Headway Manual Resist Spinner Training
Heidelberg MLA 150 heidelberg	SNF Exfab Paul G Allen 104 Stinson	The MLA150 is a high speed direct write lithography tool extended by capabilities formerly only available on Mask Aligners. It can expose the patterns directly without prior fabrication of a...Read more	Heidelberg Training
Heidelberg MLA 150 - 2 heidelberg2	SNF Cleanroom Paul G Allen L107	The MLA150 is a high speed direct write lithography tool extended by capabilities formerly only available on Mask Aligners. It can expose the patterns directly without prior fabrication of a...Read more	Heidelberg Training
HMDS Vapor Prime Oven, YES yes	SNF Cleanroom Paul G Allen L107	The YES prime oven dehydrates the wafers at 150ºC and primes the wafers using HMDS (Hexamethyldisilazane) allowing better coverage and adhesion between oxides and resists.Read more	YES Prime Oven Training
HMDS Vapor Prime Oven, YES2 yes2	SNF Exfab Paul G Allen 104 Stinson		Exfab YES2 HMDS oven training
Karl Suss MA-6 Contact Aligner 1 karlsuss	SNF Cleanroom Paul G Allen L107	The Karl Suss MA-6 Contact Aligner system can perform precision mask-to-wafer front- or back-side alignment and near-UV photoresist exposure in hard- and soft- contact, as well as high and low...Read more	Karl Suss MA-6 Contact Aligner 1 and 2 Training
Karl Suss MA-6 Contact Aligner 2 karlsuss2	SNF Cleanroom Paul G Allen L107	The Karl Suss MA-6 Contact Aligner system can perform precision mask-to-wafer front- or back-side alignment and near-UV photoresist exposure in hard- and soft- contact, as well as high and low...Read more	Karl Suss MA-6 Contact Aligner 1 and 2 Training
Laurell Manual Resist Spinner laurell-R	SNF Cleanroom Paul G Allen L107		Laurell Manual Resist Spinner Training
Mask Scrubber masksrub	SNF Cleanroom Paul G Allen L107	Manual mask cleaner for 5 inch masks, water under pressure. Read more	Mask Scrubber Training
Micro Mist Coater PDR-04 micromist-coater	SNF Exfab Paul G Allen 104 Stinson	The Micro Mist coater is a research grade mini electrospray tool. It can be used to blanket coat material onto a substrate with minimal wastage of the material. It can...Read more	Micromist Coater Training
SVG Develop Track 1 svgdev	SNF Cleanroom Paul G Allen L107	The SVG (Silicon Valley Group) developer is an automated system with two independent tracks (svgdev and svgdev2) for developing and post-baking exposed photoresist-coated 4" wafers. Each track system includes two...Read more	SVG Resist Develop tracks 1 and 2 Training