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HSQ bonding in evbond

PROM Request Title: 
HSQ bonding in evbond
PROM Request Summary: 
Bonding procedure developed with SNF staff to use HSQ in evbond.
PROM Date: 
08/13/2015
PROM Decision: 
Request approved.
Link to PROM Request and supporting documentation: 
HSQ bonding in evbond
Equipment List: 
EVG Wafer Bonder (evbond)
SVG Resist Coat Track 1 (svgcoat)
Plasma Therm Versaline LL ICP Deep Silicon Etcher (PT-DSE)
Plasma Therm Versaline LL ICP Metal Etcher (PT-MTL)