The EVG Contact Aligner system is part of the Electronic Visions 620 aligner- 501 bonder system. This tool can perform mask-to-wafer alignment for exposure or wafer-to-wafer alignment for bonding. Our current configuration accommodates 100 or 150mm wafers for exposure with bonding substrates limited to 100mm (EV Bonder).
1:1 Contact Aligner.
Anodic Bond, backside align, including IR.