EV Group Contact Aligner (evalign)
The EV Contact Aligner system is part of the Electronic Visions 620 aligner- 501 bonder system. This tool can perform mask-to-wafer alignment for exposure or wafer-to-wafer alignment for bonding. Our current configuration accommodates 100 or 150mm wafers for exposure with bonding substrates limited to 100mm (EV Bonder).
Capabilities and Specifications
Max Exposure Area:
5 inch mask = 4 inch, 7 inch mask = 6 inch
Process Temperature Range:
1:1 Contact Aligner.
Anodic Bond, backside align, including IR.
Lab Facility, Location, and Badger Information
Training and Maintenance
Steps to become a tool user
Sign up for the relevant training scheduled in
Read the relevant operating procedures:
Contact a qualified user of the tool to arrange to ‘shadow’. It would be best to find someone who has used the system often. If you don’t know of anyone, you may check reservations or history to find a qualified user. You may also contact the Discussion Lists
. We recommend that you be with the lab member for the full time while operating the tool and ask lots of questions during the shadowing. You may have to shadow a qualified user more than one time to be comfortable with the tool.
Print the SNF Training Shadowing Form
on clean room paper.