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EV Group Contact Aligner (evalign)

Overview

The EV Contact Aligner system is part of the Electronic Visions 620 aligner- 501 bonder system. This tool can perform mask-to-wafer alignment for exposure or wafer-to-wafer alignment for bonding. Our current configuration accommodates 100 or 150mm wafers for exposure with bonding substrates limited to 100mm (EV Bonder).

Cleanliness: 

Processing Technique(s)

Capabilities and Specifications

Lithography Specifications

Minimum Resolution: 
1.50 μm
Exposure Wavelength: 
350 - 450 nm
Mask Size: 
Max Exposure Area: 
5 inch mask = 4 inch, 7 inch mask = 6 inch
Process Temperature Range: 
Maximum Load: 
one piece or wafer
Notes: 

1:1 Contact Aligner.
Anodic Bond, backside align, including IR.

Lab Facility, Location, and Badger Information

Training and Maintenance

Lab Facility: 
Training Charges: 
1.50 hours
Primary Trainer: 
Backup Trainer(s): 
Primary Maintenance: 
Backup Maintenance: 

Steps to become a tool user

  1. Become a member of SNF.
  1. "All Litho" class is required before training on any of the lithography tools. Please send an email to all-litho-training@lists.stanford.edu to sign up for the All Litho class. Read more here: All Litho class.
  2. Read the relevant operating procedures:
  3. Contact the primary trainer: .

Operating Instructions