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EV Group Contact Aligner (evalign)


The EV Contact Aligner system is part of the Electronic Visions 620 aligner- 501 bonder system. This tool can perform mask-to-wafer alignment for exposure or wafer-to-wafer alignment for bonding. Our current configuration accommodates 100 or 150mm wafers for exposure with bonding substrates limited to 100mm (EV Bonder).


Processing Technique(s)

Capabilities and Specifications

Lithography Specifications

Minimum Resolution: 
1.50 μm
Exposure Wavelength: 
350 - 450 nm
Mask Size: 
Max Exposure Area: 
5 inch mask = 4 inch, 7 inch mask = 6 inch
Process Temperature Range: 
Maximum Load: 
one piece or wafer

1:1 Contact Aligner.
Anodic Bond, backside align, including IR.

Lab Facility, Location, and Badger Information

Training and Maintenance

Lab Facility: 
Training Charges: 
1.50 hours
Primary Trainer: 
Primary Maintenance: 
Backup Maintenance: 

Steps to become a tool user

  1. Become a member of SNF.
  1. "All Litho" class is required before training on any of the lithography tools. Please send an email to to sign up for the All Litho class. Read more here: All Litho class.
  2. Sign up for the relevant training scheduled in .
  3. Read the relevant operating procedures:
  4. Shadowing: Contact a qualified user of the tool to arrange to ‘shadow’. It would be best to find someone who has used the system often. If you don’t know of anyone, you may check reservations or history to find a qualified user. You may also contact the Discussion Lists. We recommend that you be with the lab member for the full time while operating the tool and ask lots of questions during the shadowing. You may have to shadow a qualified user more than one time to be comfortable with the tool.
    Print the SNF Training Shadowing Form on clean room paper.
  5. Contact the primary trainer: .

Operating Instructions