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Clean (Ge)

The "Clean (Ge)" cleanliness group is part of the SNF/ExFab contamination policy. For more information please click here.

The following is a list of equipment that fall into the "Clean (Ge)" category.

Equipment name & Badger ID	Training Required & Charges	Cleanliness	Lab Organization	Location	Notes
AMAT P5000 Etcher p5000etch	AMAT P5000 Etcher Training	Clean, Clean (Ge), Semiclean	SNF	SNF Cleanroom Paul G Allen L107
Wet Bench Germanium wbgen2	Wet Bench Germanium Training	Clean (Ge)	SNF	SNF Cleanroom Paul G Allen L107	Clean Germanium wafers only: Pre-Diffusion Clean
Wet Bench Resist Strip wbresstrip-1	Wet Bench Resist Strip	Clean (Ge), Semiclean, Flexible	SNF	SNF Cleanroom Paul G Allen L107	Wet Resist Removal: SRS-100 or PRS1000

Equipment name & Badger ID	Technique	Cleanliness	Primary Materials Etched	Other Materials Etched	Material Thickness Range	Minimum Resolution	Objective Separation	Process Temperature Range	Chemicals	Gases	Substrate Size	Substrate Type	Maximum Load
AMAT P5000 Etcher p5000etch	Etching > Dry Etching > Capacitively Coupled Plasma Etching (CCP) > Reactive Ion Etching (RIE) > Magnetically Enhanced RIE (MERIE)	Clean, Clean (Ge), Semiclean	Si based materials Si SiGe SiN SiO₂ SiON Poly Silicon	C C C dimethylpolysiloxane poly(p-xylylene) SiC Ti Various C-based W WSi₂ PI Resist Ti Tungsten						80% He/ 20%O₂ Ar CF₄ CHF₃ Cl₂ HBr He N₂ NF₃ O₂ SF₆
Wet Bench Germanium wbgen2	Cleaning > Pre-Diffusion Clean: Germanium	Clean (Ge)							50:1 HF		4"	(Ge)	25
Wet Bench Resist Strip wbresstrip-1	Cleaning > Resist Removal > Wet Resist Removal	Clean (Ge), Semiclean, Flexible	Resist					20 °C - 60 °C	PRS-1000 SRS-100		Pieces 2" 3" 4"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (SiC)	25 4 inch wafers