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Clean (Ge)

The "Clean (Ge)" cleanliness group is part of the SNF/ExFab contamination policy.

The following is a list of equipment that fall into the "Clean (Ge)" category.

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Equipment name & Badger IDsort ascending Technique Cleanliness Primary Materials Etched Other Materials Etched Material Thickness Range Minimum Resolution Objective Separation Process Temperature Range Chemicals Gases Substrate Size Substrate Type Maximum Load
Wet Bench Resist Strip
Clean (Ge), Semiclean, Flexible
20 °C - 60 °C
25 4 inch wafers
AMAT P5000 Etcher
Clean, Clean (Ge), Semiclean