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All

The "All" cleanliness group is part of the SNF/ExFab contamination policy.

The following is a list of equipment that fall into the "All" category.

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Equipment name & NEMO ID Training Required & Chargessort descending Cleanliness Location Notes
Ultraviolet Photoresist Cure
uvcure
Ultraviolet Photoresist Cure Training All SNF Cleanroom Paul G Allen L107
Xactix Xenon Difluoride Etcher
xactix
Xactix Xenon Difluoride Etcher Training All SNF Cleanroom Paul G Allen L107

Isotropic Si etching; can be used for backside Si removal on small pieces

HMDS Vapor Prime Oven, YES
yes
YES Prime Oven Training All SNF Cleanroom Paul G Allen L107

Two programs: Singe and HMDS prime or Singe only. No Resist allowed!

Sensofar S-neox
s-neox
Sensofar S-neox Training All SNF Cleanroom Paul G Allen L107

non contact 3D optical profiling

Flexus 2320 Stress Tester
stresstest
Stress Tester Flexus 2320 Training All SNF Cleanroom Paul G Allen L107
PlasmaTherm Versaline HDP CVD System
hdpcvd
PlasmaTherm Versaline HDP CVD System Training All SNF Cleanroom Paul G Allen L107

To maintain cleanliness level there are cleans required for both the chamber and wafers prior to processing -

Substrates in clean category: Pre-Diffusion Clean

For semi-clean substrates: Standard Metal Clean (SRS100 + PRS1000) .  Run Chamber clean (no dummies) and conditioning with clean dummies prior to run

Heidelberg MLA 150
heidelberg
Heidelberg Training All SNF Exfab Paul G Allen 104 Stinson

Direct Write

Heidelberg MLA 150 - 2
heidelberg2
Heidelberg Training All SNF Cleanroom Paul G Allen L107

Direct Write

Keyence Digital Microscope VHX-6000
keyence
Microscope Keyence Training All SNF Exfab Paul G Allen 104 Stinson
Nanospec 3
nanospec3
Nanospec 3 Training All SNF Cleanroom Paul G Allen L107
Headway 3 Manual Resist Spinner
headway3
Resist Coat (manual) Headway 3 Training All SNF Exfab Paul G Allen 104 Stinson
LEI1500 Contactless Sheet Resistance Mapping
eddycurrent
LEI1500 Contactless Sheet Resistance Mapping Training All SNF Exfab Paul G Allen 151 Ocean
HMDS Vapor Prime Oven, YES2
yes2
Exfab YES2 HMDS oven training All SNF Exfab Paul G Allen 104 Stinson

Singe and prime. No Resist allowed!

Reflectance Spectrometer Filmetrics F40
filmetrics
Reflectance Spectrometer Filmetrics F40 Training All SNF Cleanroom Paul G Allen L107
Lakeshore Hall Measurement System
LakeshoreHall
Lakeshore Hall Measurement System training All SNF Exfab Paul G Allen 151 Ocean
SEM -Zeiss Merlin
sem-merlin
SEM-Merlin Training All SNF Exfab Paul G Allen 104 Stinson

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Equipment name & NEMO ID Technique Cleanliness Primary Materials Etched Material Thickness Range Materials Lab Supplied Exposure Wavelength Resist Developer Process Temperature Range Gases Sample Size Limits Substrate Size Substrate Type Maximum Load
Oven 110°C post-bake
oven110
All
110 ºC
,
,
,
,
,
,
,
,
,
Oven 90°C prebake
oven90
All
90 ºC
,
,
,
,
,
,
,
,
PlasmaTherm Shuttlelock PECVD System
ccp-dep
All
100.00 Å - 4.00 μm
100 °C - 350 °C
,
,
,
,
,
,
,
,
4
PlasmaTherm Versaline HDP CVD System
hdpcvd
All
500.00 Å - 4.00 μm
50 °C - 150 °C
1
Prometrix Resistivity Mapping System
prometrix
All ,
,
,
,
,
,
,
,
1
Reflectance Spectrometer Filmetrics F40
filmetrics
All one piece or wafer
SEM -Zeiss Merlin
sem-merlin
All
0.00 mm - 35.00 mm
6 in wafer ,
,
,
,
,
,
,
,
,
,
Sensofar S-neox
s-neox
All ,
,
,
,
,
,
,
,
1
SPTS uetch vapor etch
uetch
All ,
,
,
,
,
,
,
,
,
1
SVG Develop Track 1
svgdev
All
,
,
,
,
,
,
,
,
25 4 inch wafers
SVG Develop Track 2
svgdev2
All
,
,
,
,
,
,
,
,
25 4 inch wafers
SVG Resist Coat Track 1
svgcoat
All
,
,
,
,
,
,
,
,
25 4 inch wafers
SVG Resist Coat Track 2
svgcoat2
All
,
,
,
,
,
,
,
,
25 4 inch wafers
Ultraviolet Photoresist Cure
uvcure
All 254 nm
Woollam
woollam
All ,
,
,
,
,
,
,
,
,
,
,
,
,
1
Xactix Xenon Difluoride Etcher
xactix
All ,
,
,
,
,
,
,
,
,
1

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