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Resist Exposure Equipment Summary

Resist Exposure Equipment

Processing Techniques Equipment name (NEMO ID) Cleanliness Minimum Resolutionsort descending Exposure Wavelength Substrate Size Mask Size Notes
Stepper ASML PAS 5500/60 i-line Stepper (asml) All 0.45 μm 365 nm
5 inch

5:1 reducing stepper

Direct Write Heidelberg MLA 150 - 2 (heidelberg2) All 0.60 μm 375 nm

Direct Write

Direct Write Heidelberg MLA 150 (heidelberg) All 1.00 μm 405 nm

Direct Write

Contact Aligner Karl Suss MA-6 Contact Aligner (karlsuss2) All 1.50 μm 365 nm or 405 nm 4 inch, 5 inch, 7 inch

1:1 Contact Aligner.
Backside align.

Contact Aligner Karl Suss MA-6 Contact Aligner (karlsuss) All 1.50 μm 365 nm 4 inch, 5 inch, 7 inch

1:1 Contact Aligner.
Backside align, including IR.

Contact Aligner EVG Contact Aligner (evalign) All 1.50 μm 350 - 450 nm 5 inch, 7 inch

1:1 Contact Aligner.
Anodic Bond, backside align, including IR.

Last modified: 30 Apr 2020