Heidelberg MLA 150 - 2 (heidelberg2)

The MLA150 is a high speed direct write lithography tool extended by capabilities formerly only available on Mask Aligners. It can expose the patterns directly without prior fabrication of a mask resulting in a significantly shorter prototyping cycle. It offers topside alignment only , and a light source which generates sufficient dose to expose even thick and less sensitive resists. It also has high aspect ratio feature which will enable exposing features in a resist with aspect ratios of upto 10:1. The sample size range allowed on MLA150 are 2 mm  X 2 mm to 150 mm X 150 mm and allowed thickness range from 100 um - 6 mm. MLA 150 provides for flexible change of pattern, distortion compensation and other software corrections. Currently, the exposure wavelength is 375 nm in the tool.  Please contact Swaroop Kommera if you have any questions regarding the substrates or resists that can be used. The system can produce structures down to 600nm. The alignment accuracy can be as good as 250 nm under optimized conditions.

Once you are trained on the tool, please join the tool discussion list. The instruction and the lists are located at https://snfexfab.stanford.edu/snf/join/discussion-lists