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Heidelberg MLA 150 (heidelberg)

Overview

[Photo: image of user at Heidelberg]

The MLA150 is a high speed direct write lithography tool extended by capabilities formerly only available on Mask Aligners. It can expose the patterns directly without prior fabrication of a mask resulting in a significantly shorter prototyping cycle. It offers topside alignment and backside alignment with high accuracy, and a light source which generates sufficient dose to expose even thick and less sensitive resists. The sample size range allowed on MLA150 are 5 mm  X 5 mm to 150 mm X 150 mm and allowed thickness range from 100 um - 6 mm. MLA 150 provides for flexible change of pattern, distortion compensation and other software corrections. For backside alignment, the substrate needs to be big enough that the alignment marks can be seen through the slots on the chuck. Please refer to the chuck dimensions on page 69 of the user guide attached below. Currently, the exposure wavelength is 405 nm in the tool. Please use resists that can be exposed at 405 nm or higher wavelengths. Please contact Swaroop Kommera if you have any questions regarding the substrates or resists that can be used. The system can produce structures down to 1 µm. The alignment accuracy can be as good as 250 nm under optimized conditions.

Once you are trained on the tool, please join the tool discussion list. The instruction and the lists are located at https://snfexfab.stanford.edu/snf/join/discussion-lists

Cleanliness: 

Processing Technique(s)

Capabilities and Specifications

Lithography Specifications

Minimum Resolution: 
1.00 μm
Exposure Wavelength: 
405 nm
Process Temperature Range: 
Maximum Load: 
1
Notes: 

Direct Write

Lab Facility, Location, and Badger Information

Lab Organization: 
Badger Area: 
Badger ID: 
heidelberg

Training and Maintenance

Lab Facility: 
Training Charges: 
2.00 hours
Primary Trainer: 
Primary Maintenance: 

Steps to become a tool user

  1. Become a member of SNF.
  1. "All Litho" class is required before training on any of the lithography tools. Please send an email to all-litho-training@lists.stanford.edu to sign up for the All Litho class. Read more here: All Litho class.
  2. Contact the primary trainer: Please send the following information - substrate size and type, types of resists, resist thickness(es), minimum feature size, substrate relief ((i.e., highest point – lowest point on substrate in the Z direction), Special situations - Whether you are planning to tape the substrate to another substrate etc
  3. Once you send me the information, read the materials and watched the videos, please shadow a user atleast 2 times. It is best to shadow a user who has similar substrate dimension as yours. After the first shadowing, please go through the reading material again. Please shadow twice. Once you have done the shadowing, please let me know. The next step would be tool training  session.
  4. Shadowing: Contact a qualified user of the tool to arrange to ‘shadow’. It would be best to find someone who has used the system often. If you don’t know of anyone, you may check reservations or history to find a qualified user. You may also contact the . We recommend that you be with the lab member for the full time while operating the tool and ask lots of questions during the shadowing. You must a qualified user twice to be comfortable with the tool.
    Follow the instructions on this form: SNF Training Shadowing Form