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Resist Exposure Equipment Summary

Resist Exposure Equipment

Processing Techniques Equipment name (NEMO ID) Cleanliness Minimum Resolution Exposure Wavelengthsort descending Substrate Size Mask Size Notes
Contact Aligner EVG Contact Aligner (evalign) All 1.50 μm 350 - 450 nm 5 inch, 7 inch

1:1 Contact Aligner.
Anodic Bond, backside align, including IR.

Contact Aligner Karl Suss MA-6 Contact Aligner (karlsuss) All 1.50 μm 365 nm 4 inch, 5 inch, 7 inch

1:1 Contact Aligner.
Backside align, including IR.

Stepper ASML PAS 5500/60 i-line Stepper (asml) All 0.45 μm 365 nm
5 inch

5:1 reducing stepper

Contact Aligner Karl Suss MA-6 Contact Aligner (karlsuss2) All 1.50 μm 365 nm or 405 nm 4 inch, 5 inch, 7 inch

1:1 Contact Aligner.
Backside align.

Direct Write Heidelberg MLA 150 - 2 (heidelberg2) All 0.60 μm 375 nm

Direct Write

Direct Write Heidelberg MLA 150 (heidelberg) All 1.00 μm 405 nm

Direct Write

Last modified: 30 Apr 2020