The "Clean" cleanliness group is part of the SNF/ExFab contamination policy.
The following is a list of equipment that fall into the "Clean" category.
Equipment name & NEMO ID | Training Required & Charges | Cleanliness | Location | Notes |
---|---|---|---|---|
Wet Bench Clean 1 wbclean-1 |
Wet Bench Clean1and2 Training | Clean | SNF Cleanroom Paul G Allen L107 |
No resist allowed. Resist should have been removed at the wbclean_res-piranha. |
Gasonics Aura Asher gasonics |
Resist Removal Dry Gasonics Training | Clean, Semiclean | SNF Cleanroom Paul G Allen L107 |
Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Wafers heated by lamps. |
Lam Research TCP 9400 Poly Etcher lampoly |
Lam Research TCP 9400 Poly Etcher Training | Clean, Semiclean | SNF Cleanroom Paul G Allen L107 |
Single wafer etch with auto-loading from a cassette. Equipment originally used for gate etching with high selectivity to thin gate oxides. |
Aixtron MOCVD - III-N system aix-ccs |
MOCVD - III-N Aixtron training | Clean (MOCVD) | SNF MOCVD Paul G Allen 213XA |
N and P doping available. |
Equipment name & NEMO ID | Technique | Cleanliness | Primary Materials Etched | Process Temperature Range | Chemicals | Substrate Size | Substrate Type | Maximum Load |
---|---|---|---|---|---|---|---|---|
Wet Bench Clean_res-piranha wbclean_res-piranha |
Clean |
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Wet Bench CMOS Metal wbclean3 |
Semiclean |
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25 wafers | |||||
Wet Bench Decontamination wbdecon |
Clean |
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Wet Bench Resist Strip wbresstrip-1 |
Clean (Ge), Semiclean, Flexible |
20 °C - 60 °C
|
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25 4 inch wafers |