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Deep Oxide Etch in PT-Ox to Replace Dicing and Polishing Process
Project Type:
E241
Date:
June 2015
Areas of Interest:
Etch process to replace dicing and polishing for photonic waveguide testing
Function and Method:
Reactive Ion Etching (RIE)
Wafer Saw
Researchers and (Mentors):
Alex Piggott, (Usha Raghuram)
List of Important Equipment:
Plasma Therm Versaline LL ICP Dielectric Etcher (PT-Ox)
Presentation(s):
Deep oxide etch in Pt-Ox to replace dicing & polishing process- Final Presentation
Report(s):
Deep oxide etch in Pt-Ox to replace dicing and polishing process- Final Report
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