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Deep Oxide Etch in PT-Ox to Replace Dicing and Polishing Process

Project Type: 
E241
Date: 
June 2015
Areas of Interest: 
Etch process to replace dicing and polishing for photonic waveguide testing
Report(s): 
Deep oxide etch in Pt-Ox to replace dicing and polishing process- Final Report
Processing Technique (former Function and Method): 
Reactive Ion Etching (RIE)
Wafer Saw
Researchers and (Mentors): 
Alex Piggott, (Usha Raghuram)
List of Important Equipment: 
Plasma Therm Versaline LL ICP Dielectric Etcher (PT-Ox)
Presentation(s): 
Deep oxide etch in Pt-Ox to replace dicing & polishing process- Final Presentation