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nSiL: 155A Venice

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Equipment name & Badger ID Technique Cleanliness Primary Materials Etched Material Thickness Range Materials Lab Supplied Materials User Supplied Minimum Resolution Objective Separation Process Temperature Range Gases Substrate Size Substrate Type Maximum Load
AJA Evaporator
aja-evap
Flexible
0 - 300 nm
,
,
,
,
,
,
,
,
,
,
,
4"x3 or 6"x1 wafers or pieces
DISCO Wafer Saw
DISCO wafersaw
Flexible
,
,
,
,
,
,
,
,
1x4", 1x6" or 1x8" wafer, or pieces
Epilog Fusion M2 Laser Cutter
lasercutter
Flexible
Hummer V Sputter Coater
hummer
Flexible
Lesker Sputter
lesker-sputter
Flexible
,
,
,
,
,
,
,
,
,
1 4 inch wafer, 1 6 inch wafer
Minitech-GX Micromill
micromill
Flexible
Optomec Printer
optomec-printer
Flexible
Oriel Deep UV Exposure Lamp
oriel-duv
Flexible
Plasmaetch PE-50
plasma-etch
Flexible
Multiple