Deposition covers a wide variety of methods that are used to add a wide variety of materials. The subcategories here can be useful to help narrow down your search.
Atomic Layer Deposition (ALD) is used to deposit less than 50nm of highly conformal films.
Chemical Vapor Deposition (CVD) is used to deposit films less than 5μm thick, carbon nanotubes, and graphene.
Deposited III-N uses a type of CVD called MOCVD to deposit the nitrides of materials that are found in group III of the periodic table.
Deposited III-V uses a type of CVD called MOCVD to deposit combinations of materials from group III and group V of the periodic table.
Ink lists the equipment that can be used to print inks that are either commercially available or made by the user.
Physical Vapor Deposition (PVD) is used to deposit primarily metal layers as well as some dielectrics.
No equipment matches all of the filter criteria you have set above. Especially make sure only Main Purpose OnlyORFull Purpose has something in it other than "- Any -"—they do not play well with each other!
Our goal was to develop a process for sputtering of NVM-quality TiN using the new Lesker sputtering tool (Lesker-2) that resides inside the cleanroom. This tool can achieve the high-vacuum pressures necessary for TiN films with low levels of oxygen contamination.