GnP POLI-400L (cmp)
Overview
GNP-400
The POLI-400L CMP (Chemical Mechanical Polishing) system is designed to polish standard 4” wafers (no pieces). CMP is often used to polish wafers, to planarize patterned surfaces, and to smooth surface roughness.
Cleanliness:
Processing Technique(s)
Capabilities and Specifications
Process Temperature Range:
Lab Facility, Location, and Badger Information
Lab Organization:
Location:
Badger Area:
Badger ID:
cmp
Training and Maintenance
Lab Facility:
Training Charges:
1.50 hours
Primary Trainer:
Primary Maintenance:
Steps to become a tool user
-
Become a member of SNF.
- Read the relevant operating procedures:
- Shadow other labmembers who are using the tool. Make sure to get hands on experience with set up and clean up since these are critical to proper tool function.
- Contact the primary trainer: . If you are having trouble finding people to shadow, please contact Michelle.
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