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Development of thermocompression and eutectic bond processes for pre-patterned substrates using the Finetech Lambda
Project Type:
E241
Date:
December 2016
Areas of Interest:
Flip Chip Bonding
Function and Method:
Bonding
Researchers and (Mentors):
KiWook Jung, Heungdong Kwon, (Usha Raghuram)
List of Important Equipment:
Finetech Lambda (flipchipbonder)
Report(s):
Development of thermocompression and eutectic bond processes for pre-patterned substrates using the Finetech Lambda- Final Report
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