Finetech Lambda (flipchipbonder)
Overview
FINEPLACER® lambda is a flexible sub-micron die-bonder for precision die attach and advanced chip packaging. It offers a modular design and can be easily reconfigured for future applications, making it the premier choice when maximum technological versatility and fast process implementation is key. Typical fields of application include R&D, universities, prototyping and low-volume production.The system handles a wide range of applications, including laser bar and diode bonding with Indium or Au/Sn, VCSEL/photo diode bonding (glueing, curing) and the multi-stage assembly of opto electro mechanical systems (i.e. MEMS/MOEMS) for communications and medical technology products.
Cleanliness:
Processing Technique(s)
Capabilities and Specifications
Process Temperature Range:
°C - 400 °C
Substrate Type
Substrate Sizes
Maximum Load:
1
Lab Organization, Location, and NEMO Information
Lab Organization:
Location:
NEMO Area:
nSiL: L104 Stinson
NEMO ID:
flipchipbonder
Training and Maintenance
Lab Facility:
Training Charges:
1.00 hours
Primary Trainer:
Primary Maintenance:
Steps to become a tool user
-
Become a member of SNF.
- Contact the primary trainer: Swaroop Kommera
