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Finetech Lambda (flipchipbonder)

Overview

FINEPLACER® lambda is a flexible sub-micron die-bonder for precision die attach and advanced chip packaging. It offers a modular design and can be easily reconfigured for future applications, making it the premier choice when maximum technological versatility and fast process implementation is key. Typical fields of application include R&D, universities, prototyping and low-volume production.The system handles a wide range of applications, including laser bar and diode bonding with Indium or Au/Sn, VCSEL/photo diode bonding (glueing, curing) and the multi-stage assembly of opto electro mechanical systems (i.e. MEMS/MOEMS) for communications and medical technology products.

Cleanliness: 

Processing Technique(s)

Capabilities and Specifications

Process Temperature Range: 
°C - 400 °C
Maximum Load: 
1

Lab Facility, Location, and Badger Information

Badger Area: 
Badger ID: 
flipchipbonder

Training and Maintenance

Lab Facility: 
Training Charges: 
1.00 hours
Primary Trainer: 
Primary Maintenance: 

Steps to become a tool user

  1. Become a member of SNF.
  1. Contact the primary trainer: .