The "Clean" cleanliness group is part of the SNF/ExFab contamination policy.
The following is a list of equipment that fall into the "Clean" category.
Equipment name & NEMO ID | Training Required & Charges | Cleanliness | Location | Notes |
---|---|---|---|---|
AMAT Centurion Epitaxial System epi2 |
Epitaxial AMAT Centurion Training | Clean | SNF Cleanroom Paul G Allen L107 |
N and P doping available- intrinsic to 5E19 Operating pressure range is 5-300Torr |
AMAT P5000 Etcher p5000etch |
Dry Etcher AMAT P5000 Training | Clean, Clean (Ge), Semiclean | SNF Cleanroom Paul G Allen L107 | |
Wet Bench Clean_res- hotphos wbclean_res-hotphos |
Wet Bench Clean Piranha/HF/Phosphoric Training | Clean | SNF Cleanroom Paul G Allen L107 |
Resist should have been removed |
Lesker2 Sputter lesker2-sputter |
Sputter Lesker 1&2 Training | Semiclean | SNF Cleanroom Paul G Allen L107 |
reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter |
Equipment name & NEMO ID | Technique | Cleanliness | Primary Materials Etched | Process Temperature Range | Chemicals | Substrate Size | Substrate Type | Maximum Load |
---|---|---|---|---|---|---|---|---|
Wet Bench Clean_res-piranha wbclean_res-piranha |
Clean |
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Wet Bench CMOS Metal wbclean3 |
Semiclean |
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25 wafers | |||||
Wet Bench Decontamination wbdecon |
Clean |
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Wet Bench Resist Strip wbresstrip-1 |
Clean (Ge), Semiclean, Flexible |
20 °C - 60 °C
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25 4 inch wafers |