Nano Nuggets
We have started collecting "Nano Nuggets"- useful bits of information about different processing methods that should be extremely helpful either in getting started or avoiding pitfalls along the way. Some of them are parts of more detailed project reports, so if you want more info about a nugget, the report should be linked. Check them out!
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Patterning SPR220 on Reflective Materials with Nanoscribe
Processing details for using SPR-220 positive resist on a reflective metal surface to make 3D structures on the Nanoscribe.
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Niobium Deposition and Patterning Runsheet
Processing sequence for deposition and patterning of Niobium in the SNF.
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SOP- Silicon Oxide Hardmask for Si Etching in PT-DSE
Step-by-step procedures and processing tips for fabrication of an SiOx hardmask for deep silicon etch in the SNF.
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Tips- Using Keyence for X-sectional Imaging
Tips for using the Keyence to image cross sections of wafer pieces. This can be used as a quick check before X-SEM.
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Cross-sectional Characterization of Transferred DSA Holes using Focus Ion Beam
Here, we describe our strategy for inspecting the cross-section of features transferred from the BCP into an underlying hard material (e.g. SiO2, Si). -
Waveguide fabrication with the Heidelberg MLA150 Maskless Aligner Run Sheet
In order to make the lowest loss waveguides, we need to find a combination of dose/defocus and reflow time/temperature that gives us the best resolution and the lowest line edge roughness and line width roughness. -
Characterization of TMDs and Contact schemes for Photovoltaic Applications- Standard Operating Procedure
The standard operating procedures for 1. Optimal TMD exfoliation on SiO2 substrate, 2. Etching of TMD flakes, 3. Transfer from TMD flakes from SiO2 substrate to a metallic substrate are explained in details. -
Standard Operating Procedure for MOCVD aix-ccs
This document describes things you need to check before operating the Stanford MOCVD aix-ccs tool for safety and correct operation.
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Standard Operating Procedures for TMD exfoliation, etching, and transfer
The standard operating procedures for 1. Optimal TMD exfoliation on SiO2 substrate, 2. Etching of TMD flakes, 3. Transfer from TMD flakes from SiO2 substrate to a metallic substrate are explained in details.
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Waveguide fabrication with the Heidelberg MLA150 Maskless Aligner
Process flow for optical waveguide creation using Heidelberg.
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Block Copolymer Directed Self-Assembly Standard Operating Procedure
In this standard operating procedure (SOP), we propose a recipe for DSA with 70:30 PS-b-PMMA.
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Silicon Nitride Nanoscale Stencils for Non-destructive Metal Grating Patterning
A process flow is presented to create periodic metallic gratings on the order of 150 nm using a stencil lithography technique.
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Addressing Grassing and Overetch in SiO2 Hardmask
Troubleshooting tips for roughened surfaces after etch (also called grassing or line edge roughness).
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Basics of Block Copolymer Directed Self Assembly
Block copolymer Directed Self Assembly (DSA) is a technique used to create high resolution structures without advanced lithography techniques.
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Au-Sn Eutectic chip-bonding for high heat flux vapor chamber applications using Flip Chip Bonder: Suggestions and Tips
Here are some getting started tips for use of Pyrex wafers in the SNF lithography and Flip Chip Bonding equipment.
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Nickel Silicide Bonding Tips
Helpful hints about getting started on a wafer bonding project including tools to get trained on, material selection, and device design.
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Printer-friendly version Last modified: 28 Apr 2022
