We have started collecting "Nano Nuggets"- useful bits of information about different processing methods that should be extremely helpful either in getting started or avoiding pitfalls along the way. Some of them are parts of more detailed project reports, so if you want more info about a nugget, the report should be linked. Check them out!
Processing details for using SPR-220 positive resist on a reflective metal surface to make 3D structures on the Nanoscribe.
Processing sequence for deposition and patterning of Niobium in the SNF.
Step-by-step procedures and processing tips for fabrication of an SiOx hardmask for deep silicon etch in the SNF.
Tips for using the Keyence to image cross sections of wafer pieces. This can be used as a quick check before X-SEM.
This document describes things you need to check before operating the Stanford MOCVD aix-ccs tool for safety and correct operation.
The standard operating procedures for 1. Optimal TMD exfoliation on SiO2 substrate, 2. Etching of TMD flakes, 3. Transfer from TMD flakes from SiO2 substrate to a metallic substrate are explained in details.
Process flow for optical waveguide creation using Heidelberg.
In this standard operating procedure (SOP), we propose a recipe for DSA with 70:30 PS-b-PMMA.
A process flow is presented to create periodic metallic gratings on the order of 150 nm using a stencil lithography technique.
Troubleshooting tips for roughened surfaces after etch (also called grassing or line edge roughness).
Block copolymer Directed Self Assembly (DSA) is a technique used to create high resolution structures without advanced lithography techniques.
Here are some getting started tips for use of Pyrex wafers in the SNF lithography and Flip Chip Bonding equipment.
Helpful hints about getting started on a wafer bonding project including tools to get trained on, material selection, and device design.