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DISCO Backgrinder (disco-backgrind)

Overview

DISCO Backgrinder can be used for precision removal of Silicon, compound semiconductors, packaging resin, copper-posts and other metals, Lithium Tantalate, Lithium Niobate, Sapphire and many other materials. This tool can process sample pieces to 8 inch wafers. Reproducibility is less than 1.5um across an 8 inch surface and surface roughness possible is better than 150nm.

Cleanliness: 

Processing Technique(s)

Capabilities and Specifications

Process Temperature Range: 

Lab Facility, Location, and Badger Information

Lab Organization: 
Badger Area: 
Badger ID: 
disco-backgrind

Training and Maintenance

Lab Facility: 
Training Charges: 
2.00 hours
Primary Trainer: 
Backup Trainer(s): 
Primary Maintenance: 

Steps to become a tool user

  1. Become a member of SNF.
  1. Contact the primary trainer,
  2. Read the relevant operating procedures:

Operating Instructions