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Function and Method(s):
Bonding
Equipment Used:
Finetech Lambda (flipchipbonder)
Au-Sn Eutectic Chip-Bonding for High Heat-Flux Vapor-Chamber Applications- Final Report
Au-Sn Eutectic Chip-Bonding for High Heat-Flux Vapor-Chamber Applications- Final Report
PDF File:
Au-Sn Eutectic Chip-Bonding for High Heat-Flux Vapor-Chamber Applications- Final Report
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Thursday, August 10, 2023
