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STSetch2 Profile Characterization- Undercut Investigation for Silicon Trench Etching in STSetch2

Project Type: 
E241
Date: 
December 2010
Areas of Interest: 
STSetch2 Profile Characterization
Report(s): 
STSetch2 Profile Characterization - Undercut Investigation for Silicon Trench Etching in STSetch2- Final Report
Processing Technique (former Function and Method): 
Dry Etching
Researchers and (Mentors): 
Lele Wang, Dong Liang, Yu-Shuen Wang, (Jim McVittie)