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nSiL: L104 Stinson

New Badger Area created for occupancy limits.

mr_equipment

Specifications

Equipment name & Badger ID	Technique	Cleanliness	Material Thickness Range	Minimum Resolution	Exposure Wavelength	Resist	Developer	Objective Separation	Process Temperature Range	Substrate Size	Substrate Type	Maximum Load
Alphastep 500 Profilometer alphastep	Characterization > Surface Analysis > Profilometer > Step Profile	Flexible								Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (GaN) , (III-V) , (GaAs)	1
Digital Instruments AFM Nanoscope Dimension 3000 afm2	Characterization > Surface Analysis > Profilometer > Atomic Force Microscopy (AFM)	All								Pieces 2" 3" 4"
Ex Fab Develop Wet Bench wbexfab_dev	Optical Photolithography > Resist Develop	Flexible								Pieces 2" 3" 4" 6" 8" 12" Other
Ex Fab Solvent Wet Bench wbexfab_solv	Patterning > Metal Lift-off Cleaning > Solvent Cleaning	Flexible								Pieces 2" 3" 4" 6" 8" Other
Finetech Lambda flipchipbonder	Bonding	Flexible							°C - 400 °C	Pieces 4"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge)	1
Headway 3 Manual Resist Spinner headway3	Optical Photolithography > Resist coat > Resist Coat (manual)	Flexible				Resists Shipley 3612 resist SPR220-3 resist SPR220-7				Pieces 2" 3" 4"		1 piece or wafer
Heidelberg MLA 150 heidelberg	Optical Photolithography > Exposure > Direct Write	All			405 nm					Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (SiC) , (GaN) , (III-V) , (GaAs) , (Various) , (Various) , (LiNb)	1
HMDS Vapor Prime Oven, YES2 yes2	Optical Photolithography > Wafer preparation before resist > Wafer Prime (HMDS)	All					[(CH₃)₃Si]₂NH		150 ºC			25
Keyence Digital Microscope VHX-6000 keyence	Characterization	All								Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (GaN) , (III-V) , (GaAs)
Micro Mist Coater PDR-04 micromist-coater	Optical Photolithography > Resist coat > Resist Spray Coat (manual)	Flexible
Nanoscribe Photonics GT nanoscribe	3D Printing Patterning	All										1

Summary

Equipment name & Badger ID	Training Required & Charges	Cleanliness	Lab Organization	Location	Notes
Alphastep 500 Profilometer alphastep	Alphastep 500 Profilometer Training	Flexible	SNF	SNF Cleanroom Paul G Allen L107	500Å to 300µm
Digital Instruments AFM Nanoscope Dimension 3000 afm2	Digital Instruments AFM Nanoscope Dimension 3000 Training	All	SNF	SNF Exfab Paul G Allen 104 Stinson	Atomic Force Microscope. Step Profile
Ex Fab Develop Wet Bench wbexfab_dev	WbExfab_Dev Training	Flexible	SNF	SNF Exfab Paul G Allen 104 Stinson
Ex Fab Solvent Wet Bench wbexfab_solv	WbExfab_Solv Training	Flexible	SNF	SNF Exfab Paul G Allen 104 Stinson
Finetech Lambda flipchipbonder	Flip Chip Bonder Training	Flexible	SNF	SNF Exfab Paul G Allen 104 Stinson
Headway 3 Manual Resist Spinner headway3	Headway 3 Training	Flexible	SNF	SNF Exfab Paul G Allen 104 Stinson
Heidelberg MLA 150 heidelberg	Heidelberg Training	All	SNF	SNF Exfab Paul G Allen 104 Stinson	Direct Write
HMDS Vapor Prime Oven, YES2 yes2	Exfab YES2 HMDS oven training	All	SNF	SNF Exfab Paul G Allen 104 Stinson	Singe and prime. No Resist allowed!
Keyence Digital Microscope VHX-6000 keyence	Keyence Training	All	SNF	SNF Exfab Paul G Allen 104 Stinson
Micro Mist Coater PDR-04 micromist-coater	Micromist Coater Training	Flexible	SNF	SNF Exfab Paul G Allen 104 Stinson
Nanoscribe Photonics GT nanoscribe	Nanoscribe Photonics GT Training	All	SNF	SNF Exfab Paul G Allen 104 Stinson

Equipment name & Badger ID	Training Required & Charges	Cleanliness	Lab Organization	Location	Notes
Alphastep 500 Profilometer alphastep	Alphastep 500 Profilometer Training	Flexible	SNF	SNF Cleanroom Paul G Allen L107	500Å to 300µm
Digital Instruments AFM Nanoscope Dimension 3000 afm2	Digital Instruments AFM Nanoscope Dimension 3000 Training	All	SNF	SNF Exfab Paul G Allen 104 Stinson	Atomic Force Microscope. Step Profile
Ex Fab Develop Wet Bench wbexfab_dev	WbExfab_Dev Training	Flexible	SNF	SNF Exfab Paul G Allen 104 Stinson
Ex Fab Solvent Wet Bench wbexfab_solv	WbExfab_Solv Training	Flexible	SNF	SNF Exfab Paul G Allen 104 Stinson
Finetech Lambda flipchipbonder	Flip Chip Bonder Training	Flexible	SNF	SNF Exfab Paul G Allen 104 Stinson
Headway 3 Manual Resist Spinner headway3	Headway 3 Training	Flexible	SNF	SNF Exfab Paul G Allen 104 Stinson
Heidelberg MLA 150 heidelberg	Heidelberg Training	All	SNF	SNF Exfab Paul G Allen 104 Stinson	Direct Write
HMDS Vapor Prime Oven, YES2 yes2	Exfab YES2 HMDS oven training	All	SNF	SNF Exfab Paul G Allen 104 Stinson	Singe and prime. No Resist allowed!
Keyence Digital Microscope VHX-6000 keyence	Keyence Training	All	SNF	SNF Exfab Paul G Allen 104 Stinson
Micro Mist Coater PDR-04 micromist-coater	Micromist Coater Training	Flexible	SNF	SNF Exfab Paul G Allen 104 Stinson
Nanoscribe Photonics GT nanoscribe	Nanoscribe Photonics GT Training	All	SNF	SNF Exfab Paul G Allen 104 Stinson

Equipment name & Badger ID	Technique	Cleanliness	Material Thickness Range	Minimum Resolution	Exposure Wavelength	Resist	Developer	Objective Separation	Process Temperature Range	Substrate Size	Substrate Type	Maximum Load
Alphastep 500 Profilometer alphastep	Characterization > Surface Analysis > Profilometer > Step Profile	Flexible								Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (GaN) , (III-V) , (GaAs)	1
Digital Instruments AFM Nanoscope Dimension 3000 afm2	Characterization > Surface Analysis > Profilometer > Atomic Force Microscopy (AFM)	All								Pieces 2" 3" 4"
Ex Fab Develop Wet Bench wbexfab_dev	Optical Photolithography > Resist Develop	Flexible								Pieces 2" 3" 4" 6" 8" 12" Other
Ex Fab Solvent Wet Bench wbexfab_solv	Patterning > Metal Lift-off Cleaning > Solvent Cleaning	Flexible								Pieces 2" 3" 4" 6" 8" Other
Finetech Lambda flipchipbonder	Bonding	Flexible							°C - 400 °C	Pieces 4"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge)	1
Headway 3 Manual Resist Spinner headway3	Optical Photolithography > Resist coat > Resist Coat (manual)	Flexible				Resists Shipley 3612 resist SPR220-3 resist SPR220-7				Pieces 2" 3" 4"		1 piece or wafer
Heidelberg MLA 150 heidelberg	Optical Photolithography > Exposure > Direct Write	All			405 nm					Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (SiC) , (GaN) , (III-V) , (GaAs) , (Various) , (Various) , (LiNb)	1
HMDS Vapor Prime Oven, YES2 yes2	Optical Photolithography > Wafer preparation before resist > Wafer Prime (HMDS)	All					[(CH₃)₃Si]₂NH		150 ºC			25
Keyence Digital Microscope VHX-6000 keyence	Characterization	All								Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (GaN) , (III-V) , (GaAs)
Micro Mist Coater PDR-04 micromist-coater	Optical Photolithography > Resist coat > Resist Spray Coat (manual)	Flexible
Nanoscribe Photonics GT nanoscribe	3D Printing Patterning	All										1