SNF: Photolithography

mr_equipment

Specifications

Equipment name & Badger ID	Technique	Cleanliness	Exposure Wavelength	Mask Size	Max Exposure Area	Resist	Developer	Process Temperature Range	Chemicals	Substrate Size	Substrate Type	Maximum Load
110°C Oven oven110	Optical Photolithography > Resist Bake > Oven Bake > Post Bake	All						110 ºC		Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (SiC) , (GaN) , (III-V) , (GaAs)
90°C Oven oven90	Optical Photolithography > Resist Bake > Oven Bake > Prebake	All						90 ºC		Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (GaN) , (III-V) , (GaAs)
ASML PAS 5500/60 i-line Stepper asml	Optical Photolithography > Exposure > Stepper	All	365 nm	5 inch						4"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂)
Blue M Oven bluem	Optical Photolithography > Resist Bake > Oven Bake	Flexible						0 °C - 430 °C		Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (GaN) , (III-V) , (GaAs) , (Various)
Ebeam Process Wet Bench wbebres	Optical Photolithography > Resist Develop > Resist Develop (manual)	Flexible							Solvents	Pieces 2" 3" 4"
EV Group Contact Aligner evalign	Optical Photolithography > Exposure > Contact Aligner	All	350 - 450 nm	5 inch, 7 inch	5 inch mask = 4 inch, 7 inch mask = 6 inch					Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂)	one piece or wafer
EVG 101 Spray Coater evgspraycoat	Optical Photolithography > Resist coat > Resist Spray Coat (manual)	All				Resists				Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂)	1
Headway Manual Resist Spinner headway2	Optical Photolithography > Resist coat > Resist Coat (manual)	All				AZ5214IR Shipley 3612 resist SPR 955 CM-.7 resist SPR220-3 resist SPR220-7 (C₅O₂H₈)_n				Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (SiC) , (GaN) , (III-V) , (GaAs)	one piece or wafer
HMDS Vapor Prime Oven, YES yes	Optical Photolithography > Wafer preparation before resist > Singe Optical Photolithography > Wafer preparation before resist > Wafer Prime (HMDS)	All						150 ºC	[(CH₃)₃Si]₂NH	Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (GaN) , (III-V) , (GaAs)
Karl Suss MA-6 Contact Aligner 1 karlsuss	Optical Photolithography > Exposure > Contact Aligner	All	365 nm	4 inch, 5 inch, 7 inch	5 inch mask = 4 inch, 7 inch mask = 6 inch, 4 inch mask = 3 inch					Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (GaN) , (III-V) , (GaAs) , (Various)
Karl Suss MA-6 Contact Aligner 2 karlsuss2	Optical Photolithography > Exposure > Contact Aligner	All	365 nm or 405 nm	4 inch, 5 inch, 7 inch	5 inch mask = 4 inch, 7 inch mask = 6 inch, 4 inch mask = 3 inch					Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (GaN) , (III-V) , (GaAs) , (Various)
Laurell Manual Resist Spinner laurell-R	Optical Photolithography > Resist coat > Resist Coat (manual)	All				Resists SU-8 LOL			(C₅O₂H₈)_n	Pieces 2" 3" 4" 6"
Lithography Solvent Bench lithosolv	Cleaning > Solvent Cleaning	Flexible							Solvents	Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (GaN) , (III-V) , (GaAs)
Mask Scrubber masksrub	Optical Photolithography > Mask Cleaning (manual)	All		5 inch					DI Water
SVG Develop Track 1 svgdev	Optical Photolithography > Resist Develop > Resist Develop (automatic)	All					MF-26A developer			4"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (GaN) , (III-V) , (GaAs)	25 4 inch wafers
SVG Develop Track 2 svgdev2	Optical Photolithography > Resist Develop > Resist Develop (automatic)	All					MF-26A developer			4"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (GaN) , (III-V) , (GaAs)	25 4 inch wafers
SVG Resist Coat Track 1 svgcoat	Optical Photolithography > Resist coat > Resist Coat (automatic)	All				Shipley 3612 resist SPR220-3 resist SPR220-7				4"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (GaN) , (III-V) , (GaAs)	25 4 inch wafers
SVG Resist Coat Track 2 svgcoat2	Optical Photolithography > Resist coat > Resist Coat (automatic)	All				AZ5214IR Shipley 3612 resist SPR 955 CM-.7 resist				4"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (GaN) , (III-V) , (GaAs)	25 4 inch wafers
Ultraviolet Photoresist Cure uvcure	Optical Photolithography > Resist Bake > Oven Bake > UV Cure	All	254 nm
White Oven white-oven	Optical Photolithography > Resist Bake > Oven Bake	Flexible						0 °C - 200 °C		Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (GaN) , (III-V) , (GaAs)

Summary

Equipment name & Badger ID	Training Required & Charges	Cleanliness	Lab Organization	Location	Notes
110°C Oven oven110	110°C Oven Training	All	SNF	SNF Cleanroom Paul G Allen L107	Bakes wafers with resist after the development, called post-bake.
90°C Oven oven90	90°C Oven Training	All	SNF	SNF Cleanroom Paul G Allen L107	Bakes wafers after resist coating.
ASML PAS 5500/60 i-line Stepper asml	ASML PAS 5500/60 i-line Stepper Training	All	SNF	SNF Cleanroom Paul G Allen L107	5:1 reducing stepper
Blue M Oven bluem	Blue M Oven Training	Flexible	SNF	SNF Cleanroom Paul G Allen L107	Convection in N2. Cure. Programmable.
Ebeam Process Wet Bench wbebres	Ebeam Process Wet Bench Training	Flexible	SNF	SNF Cleanroom Paul G Allen L107	Manual developing of Ebeam resist
EV Group Contact Aligner evalign	EV Group Contact Aligner Training	All	SNF	SNF Cleanroom Paul G Allen L107	1:1 Contact Aligner. Anodic Bond, backside align, including IR.
EVG 101 Spray Coater evgspraycoat	EVG 101 Spray Coater Training	All	SNF	SNF Cleanroom Paul G Allen L107	Spray coating of resists
Headway Manual Resist Spinner headway2	Headway Manual Resist Spinner Training	All	SNF	SNF Cleanroom Paul G Allen L107	Adjustable spin speeds, spin time. SNF-acceptable resists or polymers. Ebeam resists
HMDS Vapor Prime Oven, YES yes	YES Prime Oven Training	All	SNF	SNF Cleanroom Paul G Allen L107	Two programs: Singe and HMDS prime or Singe only. No Resist allowed!
Karl Suss MA-6 Contact Aligner 1 karlsuss	Karl Suss MA-6 Contact Aligner 1 and 2 Training	All	SNF	SNF Cleanroom Paul G Allen L107	1:1 Contact Aligner. Backside align, including IR.
Karl Suss MA-6 Contact Aligner 2 karlsuss2	Karl Suss MA-6 Contact Aligner 1 and 2 Training	All	SNF	SNF Cleanroom Paul G Allen L107	1:1 Contact Aligner. Backside align.
Laurell Manual Resist Spinner laurell-R	Laurell Manual Resist Spinner Training	All	SNF	SNF Cleanroom Paul G Allen L107	SU-8, LOL, Ebeam resists allowed. No Acetone allowed.
Lithography Solvent Bench lithosolv	Lithography Solvent Bench Training	Flexible	SNF	SNF Cleanroom Paul G Allen L107	Manual solvent cleaning of substrates or masks. Teflon coated metal tweezers cleaning.
Mask Scrubber masksrub	Mask Scrubber Training	All	SNF	SNF Cleanroom Paul G Allen L107	5 inch mask cleaning, water under pressure, no chemicals
SVG Develop Track 1 svgdev	SVG Resist Develop tracks 1 and 2 Training	All	SNF	SNF Cleanroom Paul G Allen L107	Automatic development.
SVG Develop Track 2 svgdev2	SVG Resist Develop tracks 1 and 2 Training	All	SNF	SNF Cleanroom Paul G Allen L107	Automatic development.
SVG Resist Coat Track 1 svgcoat	SVG Resist Coat Tracks 1 and 2 Training	All	SNF	SNF Cleanroom Paul G Allen L107	Automatic Resist spinning and bake
SVG Resist Coat Track 2 svgcoat2	SVG Resist Coat Tracks 1 and 2 Training	All	SNF	SNF Cleanroom Paul G Allen L107	Automatic HMDS, Resist spinning, and Bake. AZ5214IR Image Reversal.
Ultraviolet Photoresist Cure uvcure	Ultraviolet Photoresist Cure Training	All	SNF	SNF Cleanroom Paul G Allen L107
White Oven white-oven	White Oven Training	Flexible	SNF	SNF Cleanroom Paul G Allen L107	For LOL2000 bake or bakes which are not allowed in the other ovens and need higher temperatures, up to 200C, programmable.

Equipment name & Badger ID	Training Required & Charges	Cleanliness	Lab Organization	Location	Notes
110°C Oven oven110	110°C Oven Training	All	SNF	SNF Cleanroom Paul G Allen L107	Bakes wafers with resist after the development, called post-bake.
90°C Oven oven90	90°C Oven Training	All	SNF	SNF Cleanroom Paul G Allen L107	Bakes wafers after resist coating.
ASML PAS 5500/60 i-line Stepper asml	ASML PAS 5500/60 i-line Stepper Training	All	SNF	SNF Cleanroom Paul G Allen L107	5:1 reducing stepper
Blue M Oven bluem	Blue M Oven Training	Flexible	SNF	SNF Cleanroom Paul G Allen L107	Convection in N2. Cure. Programmable.
Ebeam Process Wet Bench wbebres	Ebeam Process Wet Bench Training	Flexible	SNF	SNF Cleanroom Paul G Allen L107	Manual developing of Ebeam resist
EV Group Contact Aligner evalign	EV Group Contact Aligner Training	All	SNF	SNF Cleanroom Paul G Allen L107	1:1 Contact Aligner. Anodic Bond, backside align, including IR.
EVG 101 Spray Coater evgspraycoat	EVG 101 Spray Coater Training	All	SNF	SNF Cleanroom Paul G Allen L107	Spray coating of resists
Headway Manual Resist Spinner headway2	Headway Manual Resist Spinner Training	All	SNF	SNF Cleanroom Paul G Allen L107	Adjustable spin speeds, spin time. SNF-acceptable resists or polymers. Ebeam resists
HMDS Vapor Prime Oven, YES yes	YES Prime Oven Training	All	SNF	SNF Cleanroom Paul G Allen L107	Two programs: Singe and HMDS prime or Singe only. No Resist allowed!
Karl Suss MA-6 Contact Aligner 1 karlsuss	Karl Suss MA-6 Contact Aligner 1 and 2 Training	All	SNF	SNF Cleanroom Paul G Allen L107	1:1 Contact Aligner. Backside align, including IR.
Karl Suss MA-6 Contact Aligner 2 karlsuss2	Karl Suss MA-6 Contact Aligner 1 and 2 Training	All	SNF	SNF Cleanroom Paul G Allen L107	1:1 Contact Aligner. Backside align.
Laurell Manual Resist Spinner laurell-R	Laurell Manual Resist Spinner Training	All	SNF	SNF Cleanroom Paul G Allen L107	SU-8, LOL, Ebeam resists allowed. No Acetone allowed.
Lithography Solvent Bench lithosolv	Lithography Solvent Bench Training	Flexible	SNF	SNF Cleanroom Paul G Allen L107	Manual solvent cleaning of substrates or masks. Teflon coated metal tweezers cleaning.
Mask Scrubber masksrub	Mask Scrubber Training	All	SNF	SNF Cleanroom Paul G Allen L107	5 inch mask cleaning, water under pressure, no chemicals
SVG Develop Track 1 svgdev	SVG Resist Develop tracks 1 and 2 Training	All	SNF	SNF Cleanroom Paul G Allen L107	Automatic development.
SVG Develop Track 2 svgdev2	SVG Resist Develop tracks 1 and 2 Training	All	SNF	SNF Cleanroom Paul G Allen L107	Automatic development.
SVG Resist Coat Track 1 svgcoat	SVG Resist Coat Tracks 1 and 2 Training	All	SNF	SNF Cleanroom Paul G Allen L107	Automatic Resist spinning and bake
SVG Resist Coat Track 2 svgcoat2	SVG Resist Coat Tracks 1 and 2 Training	All	SNF	SNF Cleanroom Paul G Allen L107	Automatic HMDS, Resist spinning, and Bake. AZ5214IR Image Reversal.
Ultraviolet Photoresist Cure uvcure	Ultraviolet Photoresist Cure Training	All	SNF	SNF Cleanroom Paul G Allen L107
White Oven white-oven	White Oven Training	Flexible	SNF	SNF Cleanroom Paul G Allen L107	For LOL2000 bake or bakes which are not allowed in the other ovens and need higher temperatures, up to 200C, programmable.

Equipment name & Badger ID	Technique	Cleanliness	Exposure Wavelength	Mask Size	Max Exposure Area	Resist	Developer	Process Temperature Range	Chemicals	Substrate Size	Substrate Type	Maximum Load
110°C Oven oven110	Optical Photolithography > Resist Bake > Oven Bake > Post Bake	All						110 ºC		Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (SiC) , (GaN) , (III-V) , (GaAs)
90°C Oven oven90	Optical Photolithography > Resist Bake > Oven Bake > Prebake	All						90 ºC		Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (GaN) , (III-V) , (GaAs)
ASML PAS 5500/60 i-line Stepper asml	Optical Photolithography > Exposure > Stepper	All	365 nm	5 inch						4"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂)
Blue M Oven bluem	Optical Photolithography > Resist Bake > Oven Bake	Flexible						0 °C - 430 °C		Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (GaN) , (III-V) , (GaAs) , (Various)
Ebeam Process Wet Bench wbebres	Optical Photolithography > Resist Develop > Resist Develop (manual)	Flexible							Solvents	Pieces 2" 3" 4"
EV Group Contact Aligner evalign	Optical Photolithography > Exposure > Contact Aligner	All	350 - 450 nm	5 inch, 7 inch	5 inch mask = 4 inch, 7 inch mask = 6 inch					Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂)	one piece or wafer
EVG 101 Spray Coater evgspraycoat	Optical Photolithography > Resist coat > Resist Spray Coat (manual)	All				Resists				Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂)	1
Headway Manual Resist Spinner headway2	Optical Photolithography > Resist coat > Resist Coat (manual)	All				AZ5214IR Shipley 3612 resist SPR 955 CM-.7 resist SPR220-3 resist SPR220-7 (C₅O₂H₈)_n				Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (SiC) , (GaN) , (III-V) , (GaAs)	one piece or wafer
HMDS Vapor Prime Oven, YES yes	Optical Photolithography > Wafer preparation before resist > Singe Optical Photolithography > Wafer preparation before resist > Wafer Prime (HMDS)	All						150 ºC	[(CH₃)₃Si]₂NH	Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (GaN) , (III-V) , (GaAs)
Karl Suss MA-6 Contact Aligner 1 karlsuss	Optical Photolithography > Exposure > Contact Aligner	All	365 nm	4 inch, 5 inch, 7 inch	5 inch mask = 4 inch, 7 inch mask = 6 inch, 4 inch mask = 3 inch					Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (GaN) , (III-V) , (GaAs) , (Various)
Karl Suss MA-6 Contact Aligner 2 karlsuss2	Optical Photolithography > Exposure > Contact Aligner	All	365 nm or 405 nm	4 inch, 5 inch, 7 inch	5 inch mask = 4 inch, 7 inch mask = 6 inch, 4 inch mask = 3 inch					Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (GaN) , (III-V) , (GaAs) , (Various)
Laurell Manual Resist Spinner laurell-R	Optical Photolithography > Resist coat > Resist Coat (manual)	All				Resists SU-8 LOL			(C₅O₂H₈)_n	Pieces 2" 3" 4" 6"
Lithography Solvent Bench lithosolv	Cleaning > Solvent Cleaning	Flexible							Solvents	Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (GaN) , (III-V) , (GaAs)
Mask Scrubber masksrub	Optical Photolithography > Mask Cleaning (manual)	All		5 inch					DI Water
SVG Develop Track 1 svgdev	Optical Photolithography > Resist Develop > Resist Develop (automatic)	All					MF-26A developer			4"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (GaN) , (III-V) , (GaAs)	25 4 inch wafers
SVG Develop Track 2 svgdev2	Optical Photolithography > Resist Develop > Resist Develop (automatic)	All					MF-26A developer			4"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (GaN) , (III-V) , (GaAs)	25 4 inch wafers
SVG Resist Coat Track 1 svgcoat	Optical Photolithography > Resist coat > Resist Coat (automatic)	All				Shipley 3612 resist SPR220-3 resist SPR220-7				4"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (GaN) , (III-V) , (GaAs)	25 4 inch wafers
SVG Resist Coat Track 2 svgcoat2	Optical Photolithography > Resist coat > Resist Coat (automatic)	All				AZ5214IR Shipley 3612 resist SPR 955 CM-.7 resist				4"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (GaN) , (III-V) , (GaAs)	25 4 inch wafers
Ultraviolet Photoresist Cure uvcure	Optical Photolithography > Resist Bake > Oven Bake > UV Cure	All	254 nm
White Oven white-oven	Optical Photolithography > Resist Bake > Oven Bake	Flexible						0 °C - 200 °C		Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (GaN) , (III-V) , (GaAs)

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SNF: Photolithography

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