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Helium
Chemical Formula:
He
Gases Equipment Tabs
Etch Equipment Table
Equipment name or Badger ID
Partial words okay.
Etch Equipment
Equipment name & Badger ID
Cleanliness
Location
Primary Materials Etched
Other Materials Etched
Gases
Lam Research TCP 9400 Poly Etcher
lampoly
Clean
Semiclean
SNF Cleanroom Paul G Allen L107
Si
Ge
SiGe
80% He/ 20%O
2
C
2
F
6
CF
4
Cl
2
HBr
He
N
2
O
2
Plasma Therm Versaline LL ICP Dielectric Etcher
PT-Ox
Flexible
SNF Cleanroom Paul G Allen L107
C
Si3N4
SiC
SiO
2
Various C-based
Ar
C
4
F
8
CF
4
CHF
3
H
2
He
N
2
O
2
AMAT P5000 Etcher
p5000etch
Clean
Clean (Ge)
Semiclean
SNF Cleanroom Paul G Allen L107
Si
Si3N4
SiGe
SiO
2
SiON
C
C
C
dimethylpolysiloxane
poly(p-xylylene)
SiC
Ti
Various C-based
W
WSi
2
PI
Resist
Ti Tungsten
80% He/ 20%O
2
Ar
CF
4
CHF
3
Cl
2
HBr
He
N
2
NF
3
O
2
SF
6
Anneal/Oxidation Equipment Table
Equipment name or Badger ID
Partial words okay.
Deposition Equipment
Equipment name & Badger ID
Cleanliness
Location
Material Thickness Range
Approved Materials supplied by Lab
PlasmaTherm Shuttlelock PECVD System
ccp-dep
All
SNF Cleanroom Paul G Allen L107
100.00 Å
-
4.00 μm
Si
Si3N4
SiC
SiO
2
SiON
