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Stanford Nanofabrication Facility
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Wafer Saw
The wafer saw is used to cut substrates into smaller pieces.
Technique Tabs
Main Tab
Items per page
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Processing Techniques
Equipment name & NEMO ID
Teaser Blurb
Cleanliness
Location
Wafer Saw
DISCO Wafer Saw
DISCO wafersaw
Flexible
SNF Exfab Paul G Allen 159 Capitola
Detail Tab
Items per page
5
10
20
40
50
60
- All -
Processing Technique
Equipment name & NEMO ID
Cleanliness
Substrate Size
Maximum Load (number of wafers)
Wafer Saw
DISCO Wafer Saw
DISCO wafersaw
Flexible
Pieces
2"
3"
4"
6"
8"
1x4", 1x6" or 1x8" wafer, or pieces